ESEC
Supplier to backend semiconductor packaging.
Founded in 1968, Esec manufactures die bonding equipment for the semiconductor, telecoms and smart-card industries at its headquarters in Cham, Switzerland, and manufactures and services wire bonding systems from its Singapore assembly facility.
In 2009, the Esec back-end chip assembly equipment business unit has been sold to BE Semiconductor Industries NV (BESI) of Duiven, The Netherlands, which manufactures die sorting, flip-chip and multi-chip die bonding, packaging and plating equipment.
ESEC Postings
1 news release »
ESEC Receives Intel Quality Award
Mar 19, 2002 | ESEC received a 2001 Preferred Quality Supplier (PQS) award from Intel Corp. for outstanding performance in providing products and services deemed essential to Intel's success. The company was awarded for its efforts in supplying Intel with flip chip attach equipment and die bonders.
