Defluxing of Copper Pillar Bumped Flip-Chips April 26th

Defluxing of Copper Pillar Bumped Flip-Chips

April 26th, 11:00 AM EST

Flip-chip technology has become increasingly prevalent within the electronics industry due to its lower cost, increased package density, improved performance while maintaining or improving circuit reliability, and increased I/O density. Join ZESTRON Academy to review a recently presented study that involved using straight DI-water and novel low-concentration alkaline cleaning agent on copper pillar bumped flip-chips and the challenges of effectively cleaning flux residues from under these components.

SMT, THT, and semiconductor learning opportunities

ZESTRON Academy is pleased to invite production operators, managers and process engineers to participate in our FREE Cleaning Webinar Series. All webinars begin at 11:00 AM EDT, with a 45 minute presentation and 15 minute Q&A. If there is a specific cleaning topic you are interested in, please visit our customized training page.