Multiple Thermal Cycles

Category

Online Events

Date:

Thu, October 29, 2020

Description:

Please join ZESTRON Academy as we thoroughly examine the impact of multiple thermal cycles on the effectiveness of the PCB cleaning process. Today, multiple thermal cycles may be required for a variety of reasons in the production of printed circuit boards. This can include the presence of Surface Mount Technology (SMT) and Through Hole Technology (THT), stacked components and double-sided circuitry. With the potential for multiple reflows, it is more important than ever to have a cleaning process that is optimized for it.


2020 Cleaning Webinar Series

ZESTRON Academy is pleased to invite production operators, managers and process engineers to participate in our FREE Cleaning Webinar Series. All webinars begin at 1:30 PM EDT, with a 45 minute presentation and 15 minute Q&A.

Url:

pages.zestron.com/multiple-thermal-cycle

The Impact of Multiple Thermal Cycle on the Cleaning Process

Mar 23, 2021

Online

Why Cleaning is Critical Before Conformal Coating - March 23rd

Apr 27, 2021

Online

DI-Water vs. Chemistry - April 27th

May 25, 2021

Online

Jet Printing and Cleaning Challenges - May 25th

Jun 22, 2021

Online

Surface Cleanliness: How Clean is Clean? - June 22nd

Jul 27, 2021

Online

Solder Mask and Low Stand-off Component Cleaning – A Connection? - July 27th

See full schedule »

Your 2021 Eptac IPC Training Schedule

 Reflow System