Influence of dip-fluxing on flip-chip accuracy

Is there anyone who knows what the influence is of the dip-fluxing process on the placement accuracy of a flip-chip. If you perform dip-fluxing after component alignment, the component may be displaced on the nozzle; if you perform component alignment after fluxing, the balls may be slightly distorted because of the applied flux, and influence the quality of the vision measurement. What's the best choice (if any) - and what can be expected regarding loss of accuracy ? Regards, Alain

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