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Printed Circuit Board Assembly & PCB Design Forum

SMT electronics assembly manufacturing forum.

Sample preparation

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Hello, I did drop testing of some sample boards which had ... - Apr 12, 2016 by Sharath Sridhar  

IPC-TM-650 Test Methods Manual, 2.1.1 Subject Microsectionin... - Apr 12, 2016 by davef  

Thanks, any tips on what I have to be looking for near the I... - Apr 12, 2016 by Sharath Sridhar  

Formation and Growth of Intermetallics at the Interface Betw... - Apr 13, 2016 by davef  


Sharath Sridhar

#75526

Sample preparation | 12 April, 2016

Hello, I did drop testing of some sample boards which had 15mm SAC105&305 BGA's on them. I polished them real nice and looked it under optical microscope for cracks. Was wondering the etching procedure before looking it under SEM.

Thanks

reply »


davef

#75527

Sample preparation | 12 April, 2016

IPC-TM-650 Test Methods Manual, 2.1.1 Subject Microsectioning, Manual and Semi or Automatic Method [ https://www.ipc.org/TM/2-1-01F.pdf ]

reply »


Sharath Sridhar

#75529

Sample preparation | 12 April, 2016

Thanks, any tips on what I have to be looking for near the IMC layer?

Thanks again!

reply »


davef

#75538

Sample preparation | 13 April, 2016

Formation and Growth of Intermetallics at the Interface Between Lead-free Solders and Copper Substrates [ http://www.boulder.nist.gov/div853/Publication%20files/NIST_Apex94_Siewert.pdf ]

reply »

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