I�ve seen this chatter about "fully compatible with families of alloys" in the trade journals and never really thought about it, until you posted. [You know, stay focused, don�t get distracted by what�s going on out there, and all that stuff.] Then, after you posted, I thought "Who cares? I mean you just wash the flux residues, anywho. So, what are these people talking about?" Then DING!!! Like the mid-day sun appearing over the edge of the Fresh Kill Landfill, it dawned on me that the people that care about this drivel are NC people. Cool, eh? See, I�m not a dinosaur. [Yeh, sure]
Well now BL, you can see where this is going and probably the best course of action for you is to hit BACK.
It�s possible, but unlikely that one flux will stay active over the ~220�C to ~255�C range necessary to reflow the two alloys, not get crispy too fast, not generate a bazillion voids, and adapt to the different wetting properties of the alloys. And it would be very nice, too.
Now if Dr. Ning-Cheng Lee [or someone like him] made this flux announcement, I�d bite. I hate to cast aspersions on salestypes, because I�ve heard there has been times when they don�t lie, BUT yano what Uncle Sammy used to say? "The proof is in the pudding!" If this isn�t vaporflux, then they should be able to demonstrate minuscule innocuous residues, zero voids, and well formed connections using both materials after soldering a couple of your boards.
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