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Printed Circuit Board Assembly & PCB Design Forum

SMT electronics assembly manufacturing forum.

campos

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should I expect any issue using a lead free BGA with tin lea... - Mar 29, 2006 by

It depends on the end use of your product, but many people a... - Mar 29, 2006 by davef  

When using lead free bgas and tin lead paste is almost certa... - Apr 03, 2006 by reg  

look on the archice, you can find threads talking about same... - Apr 03, 2006 by via

bga rosh in a tin lead process

#40727

campos | 29 March, 2006

should I expect any issue using a lead free BGA with tin lead paste and oven profile???

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davef

#40735

campos | 29 March, 2006

It depends on the end use of your product, but many people are reballing their leadfree BGA.

reply »


reg

#40818

campos | 3 April, 2006

When using lead free bgas and tin lead paste is almost certain that you will find voiding no matter what type of profile is use. The best thing that you can do is optimize your profile to minimize the voiding.

reply »

GS

#40820

campos | 3 April, 2006

look on the archice, you can find threads talking about same subject, like this for istance:

http://www.smtnet.com//forums/index.cfm?fuseaction=view_thread&CFApp=1&Thread_ID=9822&#Message39424

Regards..........GS

This message was posted via the Electronics Forum @

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