Electronics Forum | Thu Aug 17 09:57:16 EDT 2006 | jwn
Hi all, I need to find a solution for a problem I have. I need to replace BGAs which have been glued to a laptop board with superglue (Loctite). How can it be done without removing the pads when trying to remove the foreign glue? thanks in advance
Electronics Forum | Mon Aug 21 15:02:53 EDT 2006 | FredC
If you really have Loctite Super Glue it is a cyanoacrylate and can be removed with acetone. If you have a Loctite aneorbic glue that has not hardened yet, acetone will remove it. If an anerobic has hardened I know of nothing that will remove it. Als
Electronics Forum | Sun Sep 03 09:50:11 EDT 2006 | davef
Se�or Tech: You mean you never stayed at a friends house and woke-up the next morning to find that they shaved your eyebrows or superglued your lips? Now, that's funny. [Well, at the time it's not always funny, but the pix are later.] Don't let th
Electronics Forum | Tue Sep 14 04:42:58 EDT 2004 | rlackey
Hello again Mr Bayram, You will need to do certain tasks to schedule - things like lubrication etc, but these are very simple tasks. But yes, if you are running a lot slower then the major service tasks will be less frequent. One thing I ought t
Electronics Forum | Fri Sep 10 09:00:40 EDT 2004 | rlackey
Hi, It should get you at least a 1997 machine, but the age isn't as critical as the UPS level - you want at least 3.2.3. They are good machines & are well built, and at least comparable with any other second user machines (although not in the Fuji/
Electronics Forum | Fri Sep 10 12:34:40 EDT 2004 | kbayram
Thanks again for your insights. I'm just learning the details of these machines so you'ill have to bear with me. The descision will be made in around 6 months so I thought I would start my research sooner rather than later. I did get the impression
Electronics Forum | Fri Aug 22 00:20:29 EDT 2008 | rameshr
Hai, In our process we are using the micro bga of size 13X13mm of pitch 0.45mm,after soldering process the bga found collapsed, we absorbed that the PCB land pattern of the BGA was not in array, uneven distribution of pads (area) & most of the pads
Electronics Forum | Thu Jul 15 12:09:10 EDT 2010 | wrongway
if the BGA has leaded balls use leaded paste if the BGA has lead free balls use lead free paste and set your oven profile to match the paste
Electronics Forum | Tue Oct 15 15:00:33 EDT 2002 | Steve Walters
Is there any info, guidelines or spec's on how many time you can rework a bga location?
Electronics Forum | Mon Jul 12 16:33:10 EDT 2010 | davef
Ideas to follow are: * Review IPC-7095 BGA Process Implementation * Look here: http://www.smtinfo.net/Db/_Ball%20Grid%20Arrays.html
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