Electronics Forum | Fri Oct 24 06:55:48 EDT 2008 | clampron
Good Morning WS, If you experieced the solder balls after reflow of a bare board through the oven, then the source of the solder is either the oven or the board. I have had boards with untented via's that were HASL'd that had entrapped solder and fl
Electronics Forum | Fri May 12 07:32:13 EDT 2000 | David Hatherall
Help. We are about to start a project to test the suitability of attaching a ceramic thick film hybrid to a pcb using solder balls. we have no previous experience of this technique and would like a few pointers in the right direction.. eg recommend
Electronics Forum | Mon Oct 27 14:28:19 EDT 2008 | patrickbruneel
Do you refer to the highlight in the picture as a solderball? Looks more like copper to me.
Electronics Forum | Fri Oct 30 08:22:57 EST 1998 | Michael Nguyen
I finally got my problem figured out on the bridging, the only thing I'm finding is that I notice some litlte solder balls on the bottom of the board. Is that normal? Is that why I'm getting bridges? Has anyone came across this problem and pass the i
Electronics Forum | Tue Nov 04 12:58:17 EST 2008 | smt123
I have to agree with Patrick here. This image appears to show a board that is NOT HASL as there is what appears to be a copper pad in the upper portion of the image. But then again the arrow tip appears to be white and I woudl expect that to be red s
Electronics Forum | Mon May 15 20:10:27 EDT 2000 | Dave F
David: How about starting with MCMs? IPC docs are: * 2225 - Sectional Design Standard for Organic Multichip Modules (MCM-L) and MCM-L Assemblies * DD-135 - Qualification Testing for Deposited Organic Interlayer Dielectric Materials for Multichip
Electronics Forum | Wed Sep 15 22:52:58 EDT 2004 | pdeuel
We had same problem. Solder balls appeared on top side of board and led to damaged second side stencles. We worked around problem by running blank boards thru oven and inspecting and removing solder before processing boards with parts.
Electronics Forum | Thu Jun 27 21:28:42 EDT 2002 | davef
You're correct that the Ni/Pd termination seems to have something to do with you solder balling. It could be related to the interaction between your paste and the Pd. I assume these are really 'fines' rather than 'balls'. Things that come to mind a
Electronics Forum | Wed Jun 21 11:30:27 EDT 2017 | ranap121212
but we do not have laminate preheating on robots. There is no flux separate application, the flux is in the soldering wire
Electronics Forum | Thu Jun 22 09:50:48 EDT 2017 | capse
Are you using nitrogen in your soldering process?
