Electronics Forum: bga (Page 4 of 546)

underfilling of bga

Electronics Forum | Tue May 19 08:20:10 EDT 2009 | Mity C

Good Morning, We are underfilling some of our BGA's. This is a specified customer requirement. The material we are using is Emerson & Cuming E-1216 (also specified by the customer) The material was selected because of a close CTE match with the PCB.

Re: bga rework m/c

Electronics Forum | Tue Nov 14 13:34:28 EST 2000 | Leon

Jack Yes I have one. But I am not in Scotland. can I help you? Leon

Re: bga rework m/c

Electronics Forum | Thu Nov 16 05:05:59 EST 2000 | andy

Jack , I am in Scotland and can help you with this . Please leave a mail address where we can talk offline . Andy .

mirco bga stencil opening

Electronics Forum | Wed Sep 25 11:11:14 EDT 2002 | xrayhipp

Try .005 or even .004 thick laser cut electopolish stencil and reduce grain size of paste. Go with 400 or 25 in the case of AIM. We had a similar prob.

cost effective bga remove

Electronics Forum | Tue Mar 09 22:06:24 EST 2004 | Ken

Two words that will send shivers down any self-respecting rework professionals spine: HEAT GUN Not affiliated with black and decker or vidal sasoon hair dryers.

underfilling of bga

Electronics Forum | Tue May 19 06:57:33 EDT 2009 | cunningham

whats the reason for the underfill? we dont underfill any of our BGAs rework could be a issue if they need to be replaced? tried DP190?

underfilling of bga

Electronics Forum | Tue May 19 08:07:56 EDT 2009 | davef

Search the fine SMTnet Archives to find threads like: http://www.smtnet.com/forums/Index.cfm?CFApp=1&Message_ID=58257

underfilling of bga

Electronics Forum | Wed Jul 01 18:49:27 EDT 2009 | stevenlimth

1smtdude, I interested in your explaination of re-work an underfill part. You mention the material can be heated to a plastic state to become vicious... do you know usually what range is the temperate? (guess it can depend on the type/manufacturer o

mirco bga stencil opening

Electronics Forum | Thu Sep 12 09:12:22 EDT 2002 | mhoughton

I have printed and placed similar devices in high volume with exactly this spec for a couple of years with no problems, are you using laser cut stencils and what type of solder paste are you using? and what is the end use of the product as it may nee

mirco bga stencil opening

Electronics Forum | Thu Sep 12 10:45:29 EDT 2002 | pbarton

We have used a laser cut stencil 0.15mm (0.006") thick with 0.3mm (0.012") square apertures radiused in the corners 0.06mm (0.0025") to aid paste release. This approach with the (type 3) paste we use has proven successful on thousands of devices plac


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