Electronics Forum | Tue Dec 23 01:25:38 EST 1997 | J.H Kim
| I'd like someone gives me a tip for elemating of voids | in the mico BGA solder joint and the method of inspection | of them, very exactly.
Electronics Forum | Sun Dec 28 05:31:59 EST 1997 | Bob Willis
We have a x ray inspection criteria video and poster set which may be of interest check out our home page www.bobwillis.co.uk | | I'd like someone gives me a tip for elemating of voids | | in the mico BGA solder joint and the method of inspection |
Electronics Forum | Thu Feb 19 12:56:29 EST 1998 | Earl Moon
| I'd like someone gives me a tip for elemating of voids | in the mico BGA solder joint and the method of inspection | of them, very exactly. Voids in excess of 20% by each solder ball volume is cause for rejection. Causes are improperly managed proc
Electronics Forum | Fri Jun 27 22:33:16 EDT 2003 | Ben
HI, I'm doing a dye penetrant and peel test of non-function BGA solder joints to locate the fracture surface. After applying dye, I found the dye ink just accumulate at the solder mask edge and spread everywhere after I peeled off the package. THis i
Electronics Forum | Sat Jun 28 08:17:21 EDT 2003 | davef
We form a barrier to contain the dye, but regardless it is messy. Actually, we no longer use dye, per say. We use the stuff machinists use for staining metal. Look here for hints: * http://www.ivf.se/Elektronik/dye_penetrant/edefault.htm * http:
Electronics Forum | Wed Aug 04 20:06:24 EDT 2004 | C.W
Customer returned a brd claim that one of the FPGA is having "cold solder joint". I inspected the the BGA location with X-ray and Ersascope, balls' shape look fine, voids are not detected, perimeter joints show shinny and smooth appearance, i have se
Electronics Forum | Wed Nov 14 10:23:51 EST 2001 | gzweig
This question and other issues on x-ray inspection of BGAs are addressed in the free PDF. publication available by e-mail entitled: Rapid and Effective X-ray Inspection of BGAs using "Signature Identification" Just place "send publication" in subj
Electronics Forum | Mon Nov 12 11:40:50 EST 2001 | caldon
Your broad question will bring many answers.You do not mention PCB type which plays a key part in the inspection specs you look for. Your question is like asking "What is the best automobile?" You will have 1,000,000 answers. Best answered this way:
Electronics Forum | Fri Jan 12 17:33:56 EST 2007 | John S.
I've not seen it on a solder joint, but I've seen it on an SMT pad that had been skipped in a wave solder operation. The boards were under inspection for poor solderability. We never really pinpointed the cause. It would make a perfect 6 pointed s
Electronics Forum | Wed Jan 14 23:08:19 EST 1998 | Ron Costa
Place your components directly on the PCB without using solder paste,unless your using high temp. solder spheres then you should use paste. If eutectic solder spheres are used try fluxing the BGA area and attach it directly to the board. This will re
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