Electronics Forum | Sat Mar 24 14:04:33 EDT 2007 | diesel_1t
if you have a regular nozzle, Z dimension is the same than Y because is a cilinder.
Electronics Forum | Fri May 29 08:22:09 EDT 2009 | scottp
It would help to see pictures, but I suspect the parts are seeing excessive strain when snapped into or removed from the pallet.
Electronics Forum | Tue Apr 24 20:26:00 EDT 2001 | kcw
We solved similar problems some time ago. Check the volume dispensed or printed. Also check that the glue or solder paste has not expired and if in doubt use a new cartridge or change supplier. Ensure the Z axis stroke and placement force is corre
Electronics Forum | Mon Mar 26 13:45:45 EDT 2007 | SKJ
Melf components are tube shaped so the X and Z values are the same. If you use 3D X-ray you can tell if the joint is attached to the board properly and you will not need the Z-dimension information. This might be a better longterm solution than usi
Electronics Forum | Mon Mar 19 05:51:24 EDT 2007 | pima
Hello I made some test on different oven and problem still occurs. The only progress is that with diffrent thermoprofil ( Ramp to Spike instead of Ramp- Soak- Spike skewed components appears at 1 % of produced parts). With Ramp - Soak-Spike we have p
Electronics Forum | Tue Apr 24 12:56:39 EDT 2001 | Steve
We are experiencing a fair amount of skewed components, mostly 0805 resistors and capacitors, during the reflow process. We have pretty much ruled out the pick-n-place and have determined that it may be happening because of variables at the paste scr
Electronics Forum | Tue Mar 06 19:45:52 EST 2007 | davef
DPAK align on the tab with leaded solders. They don't align much with unleaded solders, but we know that your Indium NC-SMQ 92J is leaded. So, there may be too much paste on the heat sink tab causing the component to float [or wim] during reflow. If
Electronics Forum | Thu Mar 08 04:39:05 EST 2007 | stimpk
Hello, For the most part the ground side width should be reduced, but more than likly you are well into a run of built pcbs? Profiles may or not help in cases of the dreaded DPACK. No issues on any other areas or components so I'd stay away from t
Electronics Forum | Thu Mar 08 15:21:43 EST 2007 | pima
To be honest this product its only a part of bigger PCB, so we have only substrate with 3 FETs on it so no other components at substrate occurs and all substrate are staying at metal fixture. WE have already window pan aperture. WE producing this pro
Electronics Forum | Thu Feb 24 11:02:29 EST 2000 | mark scheunemann
I am looking to discuss 0402 issues, specifically tombstoning/unsoldered. Any recommendations on pad size/spacing, stencil design etc would be helpful. Placement and reflow profile look good.
