Electronics Forum | Sat Dec 17 11:45:40 EST 2005 | DAM
You know, many SMD components have copper alloy leads and then a copper (or Ni) barrier on them. On the copper (or Ni) barrier there is the finish. Usually the finish is made of Sn\Pb (tin-lead), and if I solder with a Sn\Pb solder paste it's all rig
Electronics Forum | Tue Jan 09 14:15:43 EST 2018 | tozitom
Hi SMTnet, I'm newbie here and searching for information on a pcb reconvertion. So in order to reduce costs on a small pcb+ componentes+assembly I need your experience on assembling only SMT components vs SMT+TH; the point is actually my PCB has abou
Electronics Forum | Thu Apr 13 05:13:22 EDT 2000 | C.Long
Anyone have any ideas as how to track the amount of air exposure to SRAMS etc as thay move from stores onto the production floor. i am looking for ideas as how to track the exposure time from the time they are taken out of ther packaging to the time
Electronics Forum | Tue Feb 20 04:18:39 EST 2001 | chinaman
Hi everyone if once the exposure time is exceeded the only option is to bake the components. I learned there is an "old spec" for the baking conditions (24h/125C or 192h/40C) and a "new spec" which is the current standard specifying conditions of 4
Electronics Forum | Tue Feb 20 15:39:31 EST 2001 | fmonette
To my knowledge, the 40C was established as the maximum "safe temperature" for all tape and reel packaging. The actual specs may vary somewhat for different types of reel, pocket-tape, cover-tape but you must be concerned with the cover tape adhesive
Electronics Forum | Mon Jun 14 15:29:49 EDT 1999 | Sergio Luiz Vito
I am looking for more information about: 1) What kind of evaluation can I do to measure the resistance to fall off of a bottom side glueded SMT component?; 2) There is some influence of doble wave solder machine (temperature, flux, etc) in SMDs fal
Electronics Forum | Wed Aug 06 20:50:42 EDT 2003 | davef
Well, if it "keeps coming up", let's take a pass at keeping down. For: * Requirement that gold be removed from components, pads, etc. is J-STD-001C, 5.4.1 * Context of that requirement [J-STD-001C, 5.4.1] and 6 or 7 references are in IPC-HDBK-001.
Electronics Forum | Fri Mar 18 14:27:29 EST 2005 | pmd
Hold on, MyData can place no component and not detect error if the minimum and maximinum settings in the centering phase are within the mesurement of the tool it'self. Especially if the levels are down between the jaws. For insurance make sure the to
Electronics Forum | Thu Feb 24 12:08:13 EST 2000 | JAX
Mark, This topic has been discussed multiple time on this site. You can find almost all of them by searching the archives for tombstoning. That aside, have you look at your stencil apetures?(homeplate design).
Electronics Forum | Fri Jun 23 11:49:29 EDT 2000 | Big H
Is it just like that "smart" golf ball - where you tell it, "stop!!! stop!!!" ....or "go further!" go further! So this smart solder, you can tell it "don't skip!! don't skew!!"
