Electronics Contract Manufacturing, ISO 9002. SMT, Through hole, Mixed technology asseblies. ICT -Gen Rad 2286, Functional Test, Systems Intergration. Materials Management : Turn-Key and Consignment. SMT: fine pitch-15 mil, 0402, BGA. 4 SMT lines.
AUTOTRONIK-SMT is a German company provides High Precision SMT Pick & Place Machine, Stencil Printer,Reflow Oven. which are low-cost, high accuracy ,with Laser & Vision alignment, can handle 0201,0402,SOIC,PLCC,Micro-BGA,0.3mm QFP,..etc.
YAMAHA YG100R HIGH SPEED PICK AND PLACE MACHINE Model YG100RA(FNC TYPE )/YG100RB(SF TYPE) Object substrate L50×W50mm ～L510×W460mm Mounting efficiency 24000CPH/CHIP (
Product name: KE - 2070 JUKI high-speed chipmounter Product number: KE - 2070 Products in detail Features: Suitable for high speed SMT chip placementmachine of small components. Not only the element corresponding to a wide rangeof laser recogniti
Electronics Forum | Wed Feb 05 14:20:45 EST 2003 | Stephen
One thing that worked for me was simply rounding off the pads, making square pads into circlesfor the stencil. It worked but did seem a little strange turning squares into circles for 0603's and 0402's and turning cirlces for BGA's into squares, (bu
Electronics Forum | Tue Feb 04 22:28:16 EST 2003 | davef
You could reduce the paste by about 70%. Solder balling and tombstoning will be the issues to fight. The drivers to these don't change with the component size. Use the fine SMTnet Archives for background. Aperture Size and Thickness of Solder Pas
Used SMT Equipment | Screen Printers
DEK Horizon 03i automatic stencil printer Specification ： DEK Horizon 03i High Precision Automatic Solder Paste Printer designed for high precision steel mesh printing or stencil printing in SMT industry. Printing PCB size: 50x50mm to 508x510mm;
Used SMT Equipment | Flexible Mounters
Product Name: Samsung multi-function SM421 chip mounter Product number: SM421 Detailed product introduction Samsung multi function SM421 chip mounter Mounting speed: 21K CPH /QFP (IPC9850) 5.5K CPH Chip (IPC9850) The corresponding components: Ma
Industry News | 2021-04-01 09:23:35.0
Low cost SMT assembly line solution is including 7 machines. It can mount chips: 0201, 0402, 0603, 0805, 1206, diode, transistor, SOT, and QFP/BGA which the size within 40*40mm and lead pitch ≥0.3mm etc. Any inquiry would be appreciated by Mobile/WeChat: 0086 13063047785 or scan my WeChat QR code. Yours sincerely Wellman Rau Senior Manager International Business Dept. Mobile/Wechat/WhatsApp: +86 130 6304 7785 Skype: wellmanrau@yeah.net Email: wellmanrau@yeah.net
Industry News | 2011-06-24 18:52:10.0
Vicor Corporation, recently evaluated DEK’s award-winning Nano-ProTek stencil nano coating and has reported excellent results. On a densely populated board with multiple 0402, 0201, BGA and micro-BGA components, Nano-ProTek helped improve CpK and yield.
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Parts & Supplies | Pick and Place/Feeders
more than we can offer contact person:banny chen mail:zksale@hysmt.cn skype:miayuan8 motor JUKI KE730 Z Axis Motor L404-151EL8 JUKI KE730 T Axis Motor L402-021EL0 23W 24V 1.9A JUKI KE750 X Axis Motor TS4513N1820E200 E9611721000 JUKI K
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Parts & Supplies | Pick and Place/Feeders
more than we can offer contact person:banny chen mail:zksale@hysmt.cn skype:miayuan8 motor JUKI KE730 Z Axis Motor L404-151EL8 JUKI KE730 T Axis Motor L402-021EL0 23W 24V 1.9A JUKI KE750 X Axis Motor TS4513N1820E200 E9611721000 JUKI K
LISA SPIDER robot pick and place machine 2D/3D vision components copanarity check Tape & reel for tape OUT process Tray stacker for Tray IN proce/OUT process Tape IN feeder Anyfeeder for loose component sorting More under www.aatec.ch
1. Manufacturing location of yamaha medium-speed placement machine 2. YV100XG factory year period 2000-2006; YV100XGP general year: 2005-2007 (now discontinued; only second-hand equipment is on sale in the market) 3. This model is a medium-
Training Courses | | | PCB Rework and Hand Soldering Courses
The PCB rework and hand soldering courses courses cover techniques of rework and repair of PCBs, BGAs and other electronics assemblies, and teach fundamentals of soldering of electronics assemblies.
Career Center | Rochester, New York USA | Engineering
I have done my undergraduate studies in Mechanical Engineering. I am pursuing my Master's Program in Electronics Packaging. I am currently working as a Research Assistant for RIT-CEMA (Center for Electronics Manufacturing and Assembly). My research
Career Center | , | Engineering,Production
Project Management, SMT Process Engineering
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