From Screen printer through to reflow, we have equipment for your SMT Needs. We are the technology leaders in chip shooting and Pick and Place machines. From 0201 to CSP's we can place all of your components.
High Precision Dispensers - MAX Series (Non-Heated) Max Series is capable of a wide variety of dispense applications including MicroVolume, Solder Paste and Conductive Adhesive, Underfill, Surface Mount Adhesive, Dam and Fill, Encapsulations, LED En
RS-1 JUKI Fast Smart Modular Pick and Place Machine The JUKI RS-1 assembly machine has a high assembly speed up to 42000 comp / hour, (29500 comp / hour IPC9850). Mounting accuracy: ± 0.035 mm (Cpk ≧ 1). a wide range of mounted components: 0201 … 74
Electronics Forum | Wed Feb 27 04:23:13 EST 2008 | fujillews
Hi It is best to fit the VGA camera for 0201 parts make sure your software is high enough..above v1.33 although you can place without but no so good. 0.4mm tapered nozzles are best. 0201 feeder the locator base in increased by aprox 0.3mm and the ind
Electronics Forum | Mon Jun 18 21:36:06 EDT 2001 | davef
Consider profiling from all of your problem components, not just your 0201.
Used SMT Equipment | SMT Equipment
Model :FX-1R Placement speed:Chips:33,000CPH*2(25000 pic / hour)chip Component mount range:0603 (0201)chips ~20mm/26.5x11mm Station:80 Power supply:380V Size:1,880×1,731×1,490mm Weight:2,000kg
Used SMT Equipment | SMT Equipment
Model :FX-1R Placement speed:Chips:33,000CPH*2(25000 pic / hour)chip Component mount range:0603 (0201)chips ~20mm/26.5x11mm Station:80 Power supply:380V Size:1,880×1,731×1,490mm Weight:2,000kg jenny@ksunsmt.com
Industry News | 2011-09-12 12:04:25.0
GPD Global will showcase its Positive Cavity Displacement (PCD) 'H' Series high-resolution pumps in Booth #439 at the upcoming IMAPS 44th International Symposium on Microelectronics
Industry News | 2011-11-20 13:36:13.0
GPD Global has been awarded two Global Technology Awards in the categories of Adhesives/Coatings/Encapsulants and Dispensing Equipment for its PCD Dispensing on the MAX Series Platform
Parts & Supplies | Pick and Place/Feeders
Yamaha 8x2mm (for 0201 component ) feeder Pls kindly contact with us at any time, if you are insterest more info about products. Website : www.ksunsmt.com Email: jenny@ksunsmt.com Skype:jenny@ksunsmt.com MP: 0086-15629932323 What's app: 156299
Parts & Supplies | Pick and Place/Feeders
Yamaha CL 8mm feeder for 0201 component (with green handle) Pls kindly contact with us at any time, if you are insterest more info about products. Website : www.ksunsmt.com Email: jenny@ksunsmt.com Skype:jenny@ksunsmt.com MP: 0086-15629932323
Technical Library | 2020-04-14 15:56:32.0
This paper will focus on the application requirements of solder printing small aperture designs, concentrating on 008004 (inch) / 0201 (metric) size components, and the results of a design of experiment printing these challenging apertures. As Moore's law continues to be applied to component miniaturization, the next installment of reduced packaging has arrived in the form of the 008004/0201 for resistors and capacitors. Component size roughly the size of a grain of sand presents specific challenges to the solder printing process. To address these challenges, each aspect of the printing process will need be examined. This includes essential machine requirements, including correct squeegee blades, tooling support, and calibrations, to meet the demanding specifications. The correct match and design of materials will be addressed, focusing on the stencil and substrate design along with solder paste and cleaning solvent requirements. A design of experiment will be reviewed that applies the machine and materials discussed, including the printer and Solder Paste Inspection (SPI) setup and the specific machine parameters used. The results of these DOE's will then be closely examined.
Technical Library | 2023-05-02 19:03:34.0
The demand for 0201 components in consumer products will increase sharply over the next few years due to the need for miniaturization. It is predicted that over 20 billion 0201 components will be used in more than one billion cell phones worldwide by the year 2003. Therefore, research and development on 0201 assembly is becoming a very hot topic. The first step to achieve a successful assembly process is to obtain a good PCB design for 0201 packages. This paper presents the data and criteria of PCB design for 0201 packages, including the pad design for 0201 components, and the minimum pad spacing or component clearance between 0201 components or between 0201 and other components. A systematic study on pad design and pad spacing was undertaken, using two test vehicles and three Design of Experiments (DOEs). In the first DOE, 2 out of 18 types of 0201 pad designs were selected based on process yield. The second DOE was focused on pad spacing, including 10mil, 8mil, 6mil and 4mil. The third experiment was final optimization, using two types of optimized pad designs with 10mil, 8mil and 6mil pad spacing. Through the above experiments, the design guideline for PCB layout for 0201 packages and the assembly process capability are identified.
ML-A410 SMT Automated Optical Inspection Machine Feature ▶Economical and practical AOI. ▶High precision detection platform design. ▶Fast programming debugging integration. ▶Automatic recognize the Tip and Bottom side. ▶Professional SPC system.
Full Hot Air Lead-Free Reflow Oven With PC Temp Control System (A800) Introduce: 1, Heating system adopts ETA patent heating technology 2, The use of imported large current solid state relay contact output, safe, reliable, equipped with a dedicated
Training Courses | | | PCB Assembly Courses
The PCB assembly courses provide knowledge of different processes and equipment used in TH and SMT assembly of printed circuit boards.
Training Courses | | | PCB Assembly Courses
The PCB assembly courses provide knowledge of different processes and equipment used in TH and SMT assembly of printed circuit boards.
Events Calendar | Tue Dec 08 00:00:00 EST 2020 - Tue Dec 08 00:00:00 EST 2020 | Online,
SMTA California Technology Day
Events Calendar | Wed May 31 00:00:00 EDT 2023 - Wed May 31 00:00:00 EDT 2023 | Holtsville, New York USA
Long Island Chapter Meeting: Fine Feature Paste Printing, Stencil Design and Solder Technology
Career Center | Melbourne, Florida USA | Engineering,Production,Quality Control
Engineering Specialist - Advanced Manufacturing Technology organization Palm Bay, Florida � GCSD01041082 Job Description: Work in the Advanced Manufacturing Technology organization on the development, qualification, and implementation of leading-edg
Career Center | Melbourne, Florida USA | Engineering,Production
Mechanical Engineer Candidate will work in the Advanced Manufacturing Technology organization executing the development, qualification, and implementation of leading-edge manufacturing processes across a broad range of applications and support manufa
Career Center | Saginaw, Texas USA | Engineering,Maintenance,Management,Production,Quality Control,Technical Support
Over 20 Years Experience with SMT Processes at Large and Medium Sized Companies like Hitachi, Nokia, Siemens, and Variosystems Troubleshooting SMT Process Deficiencies and Recommending Short Term and Long Term Solutions. Developing Technical
Career Center | Bangalore, India | Engineering,Maintenance,Production,Technical Support
SMT Stencil designing & Knowledge of full SMT process software known CAD/CAM -circuit CAM Pro 7.3,GC Power station, GCCAM Edit,Auto CAD, Fault finding of Electronic Boards & Servicing electronic machines.
Baja Bid | https://bajabid.com/wp-content/uploads/2021/05/MY300-SX-Brochure.pdf
. (5) According to IPC 9850 Cpk 1.33 = 4σ + o£set. (6) Small chip settings, recommended for 0201 (0.6 x 0.3 mm) and below. BOARD HANDLING INLINE CONVEYOR T460 T640 Maximum board size 460 x 510 mm (18” x 20”) 640 x 510 mm (25” x 20
PCB Libraries, Inc. | https://www.pcblibraries.com/Forum/topic1383&OB=DESC.html
1.6 mm in length per the upcoming IPC-7351C 0402 Toe is now set to 0.15 mm 0201 Toe is now set to 0.12 mm 01005 Toe is now set to