Chip Scale Manufacturing Training Course


PCB Assembly Courses

Where | When:

Pennsylvania, Philadelphia | Dec. 20 - Dec. 22, 2017


To meet the demand for smaller footprints, improved electrical performance and/or higher input/output in a given space, manufacturers are investigating advanced packaging technologies. This course will allow students to make informed decisions about advanced packaging technologies (flip chips, chip scale packages, wire bonding, micro BGAs and BGAs) based upon companies’ needs.

Who Should Attend

Engineering and manufacturing managers, process engineers, technicians, machine operators and trainers responsible for making next-generation manufacturing decisions in the company.


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