Ball Grid Array, Bottom Mounted Component Design, Assembly, Inspection & Defect Elimination

Category:

PCB Assembly Courses

Description:

This session includes all BGA (Ball Grid Array), BMC (Bottom Mounted Components), PoP (Package On Package) component assembly and process setup with inspection methods and common failure detection and elimination. Bob's presentation comes alive with many unique process video clips on testing and failures which provide a clear understanding of the root cause of failure and corrective action. A FREE copy of Bob's e-book on PoP is available to delegates and a copy of his area array posters is provided to each engineer attending this course.

Bob produced the first training videos, interactive CDs on area array technology and the first book on PoP assembly and soldering

Two (2) 90 minute Sessions
May 9 and 11, 2017
12:00pm to 1:30pm Eastern (5:00pm to 6:30pm UK)
Presented by: Bob Willis, bobwillis.co.uk

Topics will include:

  • Package types
  • Design and PCB guide lines for parts
  • Assembly process options
  • Inspection standards
  • Common process and reliability failures
  • Defect Investigation techniques and corrective action

Url:

http://www.smta.org/education/presentations/presentations.cfm#bga

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