Reflow - Understanding the Complete Process & Defect Prevention

Category:

PCB Assembly Courses

Where | When:

Online | Nov. 14, 2017

Online | Nov. 16, 2017

Description:

The session includes solder paste testing, different reflow methods, reliable solder joint formation on high and low temperature and causes and cures of most common failures. Here we examine the most common process issues seen in the industry and how design, board selection and process materials can cause issues in manufacture. We look at the fundamentals of reflow with convection and vapour phase to understand the cause of failures

With over 40 years in industry and 30 solving process problems for industry Bob Willis explains the causes and curses of most reflow issues see in industry. Bob’s session features many unique process video clips on testing and failures and make his sessions come alive providing a much better understanding of the root cause of failure and corrective action. Each delegate registered on the webinar will receive a free set of wall charts on reflow soldering and temperature profiling

If you have a specific process problems with reflow send it to Bob to include in the webinar.

Topics will include:

  • Design for reflow soldering
  • Selecting the best solder paste
  • Fundamentals of solder joint formation
  • Optimising your reflow process
  • Correct profiling procedures
  • Correct PCB finish for your process
  • Common soldering problems and why they occur
  • Reliability of solder joints
  • Practical testing of solder joints

Two 90 minute Sessions
12:00pm to 1:30pm Eastern (5:00pm to 6:30pm UK)
Presented by: Bob Willis, bobwillis.co.uk

Url:

http://www.smta.org/education/presentations/presentations.cfm#reflow

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