PCB Assembly Products

IC Packaging

SMT, PCB Manufacturing products and services offered by SMTnet members.


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10 IC Packaging Products

INTEL IC Chip NU80579EZ600C

IC Packaging

Manufacturer: INTEL Product Category: IC Chips Type: System-On-Chip Mounting: ...

kynix Semiconductor

 INTEL IC Chip   NU80579EZ600C

kynix Semiconductor

kynix semiconductor is a professional independent electronic components distributor. With years' experience, we can provide almost any kinds of electronic components to buyer worldwide. You could buy

Hong Kong, China

Distributor

FINEPLACER® femto2 - Automated Sub-Micron Die Bonder

IC Packaging

Automated Prototype2Production Bonder. The FINEPLACER® femto 2 is a fully-automated die bonder with a placement accuracy of 0.5 µm @ 3 sigma. A complete machine enclosure allows very demanding applications in a controlled env...

Finetech

FINEPLACER® femto2  - Automated Sub-Micron Die Bonder

FINEPLACER® pico ma - Multi-purpose Bonder

IC Packaging

A multi-purpose bonder, offers high placement accuracy (5 micron), allowing for bonding of the smallest die with a pitch of down to 50 µm. This versatile platform is used in a wide field of micro assembly applicati...

Finetech

FINEPLACER® pico ma - Multi-purpose Bonder

FINEPLACER lambda - Flexible Sub-micron Die Bonder

IC Packaging

The FINEPLACER® lambda is a flexible sub-micron bonder used for precise placement, die attach and advanced packaging. The system offers outstanding flexibility with a modular design and can be easily reconfigured for different...

Finetech

FINEPLACER lambda - Flexible Sub-micron Die Bonder

High Force ACF Bonder

IC Packaging

Bonding forces up to 700 N with outstanding coplanarity. As the versatile FINEPLACER® pico ma system continues to evolve, a new optional configuration has been developed for the latest Anisotropic Conductive Film (ACF) applications...

Finetech

High Force ACF Bonder

Finetech

Finetech manufactures innovative, high-accuracy equipment for leading-edge bonding, micro assembly and rework challenges.

Gilbert, Arizona, USA

Repair/Rework, Soldering

Bondjet BJ931 - High Speed Fully Automatic Dual-Head Wedge Bonder

IC Packaging

The Bondjet BJ931 High Speed Fully Automatic Dual-Head Wedge Bonder meets the latest technology and flexibility demands for automotive and power electronics applications, handling thin and heavy aluminum, copper and gold wire and ribbon on two spe...

Hesse Mechatronics

Bondjet BJ931 - High Speed Fully Automatic Dual-Head Wedge Bonder

Hesse Mechatronics

Expertise and equipment to support the most intricate and challenging wire bonding applications. Fine wire wedge bonders, heavy wire bonders, ribbon bonders for backend semiconductor assembly.

Fremont, California, USA

Manufacturer of Assembly Equipment

ACF Bonding

IC Packaging

Pulsed Heat Hot Bar Bonders, Computerized Control Systems, FPD Workstations...

Microjoin

 

Microjoin

Microjoin specializes in offering microwelding, heat seal, hot bar and welding assembly equipment used in bonding and microjoining of miniature mechanical and electrical sub-assemblies.

Poway, California, USA

Manufacturer of Assembly Equipment

Embossed Carrier Tape Forming Machine

IC Packaging

Taifa-Pak's Embossed carrier tape forming machine is Fast ,Stable and Precision, you don't want to miss it! Vist our website for more detials!

Taifa-Pak Technology

Embossed Carrier Tape Forming Machine

Taifa-Pak Technology

TaiFa-PAK offer Embossed Carrier tape,Cover tape,Plastic Reel, Embossed Carrier Tape Forming machine, Automatic Taping Reel Machine, Paper Scroll Puncher Machine,Press Pocket Paper Carrier Tape and Tape & Reel ( Taping Services )

Chang'an Town,Dongguan,China, China

Tape and Reel Services

PHM Hot Bar Soldering and Bonding Machines

IC Packaging

Fancort's Hot Bar Bonding and Soldering machines are easy to use, robust and economical for bonding flex to rigid assemblies such as Flex to PCB, LCD-Flex to PCB, Flex to LCD, HSC to LCD, HSC to PCB. Microprocessor based cont...

Fancort Industries, Inc.

PHM Hot Bar Soldering and Bonding Machines

Fancort Industries, Inc.

Fancort Industries products include cutting equipment, bench air presses, and racks and fixtures.

West Caldwell, , New Jersey, USA

Manufacturer of Assembly Equipment

Mespack H-260-4 Plus Top Cap Quadruplex Horizontal Form Fill Seal Packaging Machine - Equipnet

IC Packaging

EQUIPMENT DESCRIPTION MESPACK H-260-4 PLUS TOP CAP QUADRUPLEX HORIZONTAL FORM FILL SEAL PACKAGING MACHINE    PLEASE NOTE THIS MACHIN...

EquipNet, Inc.

Mespack H-260-4 Plus Top Cap Quadruplex Horizontal Form Fill Seal Packaging Machine - Equipnet

EquipNet, Inc.

Machinery And Equipment Appraisals by EquipNet - Technical expertise and insights into used equipment market to provide better market and pricing data.

Canton, Massachusetts, USA

Equipment Dealer / Broker, Distributor, Software Manufacturer

Fluid Dispense Pump Integration

Reflow Oven