SMT & PCB Assembly Equipment

High temperature polyimide adhesive film tape

 High temperature polyimide adhesive film tape

 High temperature polyimide adhesive film tape

Model:

High temperature polyimide adhesive film tape

Category:

Other Assembly Equipment

Model Year:

2016

Condition:

new

Location:

China

Offered by:

Dongguan KingFei Technology Co.,Ltd

High temperature polyimide adhesive film tape

This is a single side tape with high temperature resistant

Specification:

Product name

PLOYIMIDE FILM ADHESIVE TAPE

Product NO.

511

Item

UNIT

SPEC

TEST METHOD

Total thickness

Mm

0.060±0.002

GB7125-1999

Film thickness

Mm

0.025

GB7125-1999

Adhesion

N/25mm

6—6.5

GB/T72792-1988

Tensile strength

N/25mm

115

GB7753-1987

Elongation

50

GB7753-1987

Insulation class

H

Usages:

Used in electrical and electrical components for a variety of insulation.

Features:

Good Performance in Adhesive Force, High Temperature Resistant, Solvent Resistance, Strong Holding Force, No residual Adhesive Left

Features:

ESD   Polyimide  Tape is a polyimide film-backed silicone adhesive tape with extremely low electrostiatic discharge properties. Antistatic properties is in back adhesive side.

Employs a proprietary technology that results in extremely low electrostatic discharge at unwind and removal form SUS. Conventional polyimide tape typically generate over 10,000volts  during use which can damage around electronic components . The low static properties  can eliminate circuit board degradation.ESD Polyimide Tape.

Company Information:

Dongguan KingFei Technology Co.,Ltd

KING FEI TECHNOLOGY CO.,LIMITED is specialized in supply Surface-Mount Technology pick & place equipments and supports most major brands of electronic assembly equipments with a large selections

dongguan, China

Pick and Place

  • Phone 18676647370

Dongguan  KingFei Technology Co.,Ltd website

Company Postings:

(430) SMT parts, accessories & PCB supplies items

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This High temperature polyimide adhesive film tape has been added in 21, Sep 2016

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