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GP1206 BGA Rework System listed by Dongguan Kingsun Technology Co.,Ltd.. Add your item for sale/wanted


GP1206 BGA Rework System

GP1206 BGA Rework System

GP1206 BGA Rework System

Model:

GP1206 BGA Rework System

Part Number:

GP1206 BGA Rework System

Category:

Inspection Equipment

Model Year:

2016

Condition:

new

Location:

China

Offered by:

Dongguan Kingsun Technology Co.,Ltd.

View GP1206 BGA Rework System on Dongguan Kingsun Technology Co.,Ltd. website »

Company Information:

Dongguan Kingsun Technology Co.,Ltd.

Dongguan KINGSUN Technology is a company which mainly provide used and new SMT parts, provide repair SMT key parts service,new/used SMT machine trading, SMT consumables and Peripherals equipment, ESD products

Dongguan, China

Adhesives/Dispensing, Assembly, Distributor, Equipment Dealer / Broker, Inspection

  • Phone 008613168405881
  • Fax 0086-0769-33355254

Dongguan Kingsun Technology Co.,Ltd. website

Company Postings:

(205) used SMT equipment marketplace items

(2769) SMT parts, accessories & PCB supplies items

(86) products in the catalog

(1) news release

GP1206 BGA Rework System Specs:

GP1206 BGA Rework System

Features:

1.       Made of high quality heating material, desoldering and soldering procedures of BGA are precisely controlled

2.       Movable heating head, able to move horizontally.

3.       Embedded industrial computer, Simens PLC control, real-time profile display, able to display set and practically –tested profiles

4.       Connect USB mouse.

5.       Profile saving up to 50000 , could input Chinese and English

6.       Temperatures of the hot air heaters could be precisely controlled , this made the rework ore reliable.

7.       Local sinkage is restrained , by the soldering supporting frame.

8.       Cool wind to lower heating,offered by powerful cross flow fans.

9.       Adjustable PCB positioning support

10.   Hand vacuum pen, for removing BGA.

11.   Both upper and lower parts are equipped with over-temperature alarming and protection apparatus.

12.   Software can be updated to auto-profile by USB, no need to set profiles

Parameter

PCB &Component Requirements

PCB maximum size

450 x 400 mm

Max Processing area

120 x 120 mm

Max PCB Thickness

4mm

Max component size

55 x 55 mm

Min component size

4 x 4mm

Max component weight

80g

Thermal Specification

Max hot air head temp

350 degree

Max lower IR heat

400 degree

Heat control adjustment

8-stage programmable temperature settings

Upper hot air head prower consumption

600W

Lower IR heating power consumption

800W

Lower IR heater power consumption

2700W

Dimensions & Power requirements

System dimension

660 x 630 x 600 mm, L x W x H

Weight

Approx 60kg

Power Requirements

Single-phase, 220V AC, 50/60 Hz

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