Moderator: Michael Sivigny
Topic:

• Machine capability on SMT Equipment
• Process capability on SMT Equipment
• Productivity enhancement through machine optimization
• Statistics behind capability evaluations

When: Discussion originally held on March 3, 2003
Description: Michael Sivigny  is a Solutions Manager for EAGLE-EYED ONE. His main emphasis has been to integrate a unique third party machine capability test method for benefit of the electronics manufacturing industry. Michael, an 8-year electronics industry professional, earned a BS degree in Manufacturing Engineering Technology at Rochester Institute of Technology with a specialization in electronics manufacturing. His career includes experience at the TRW Automotive Electronics Group as a Manufacturing Engineer; the Eastman Kodak Company as a Process/Quality Supervisor and as a SMT Process Engineer, where he completed Kodak's Six Sigma Quality Black Belt Training program.

Company Description
EAGLE-EYED ONE provides state of the art measurement technology for equipment and process capability analysis. As a professional solutions provider to the electronics industry, EAGLE-EYED ONE offers independent and objective 3rd party test methods for evaluating SMT machine capability, bringing to market a new level of sophistication for the independent comparison of SMT production equipment.
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Moderator: Jim Zanolli
Topic: Assembly methods for through-hole connectors on mixed technology PCB assemblies.
When: Discussion originally held on May 28, 2002
Description: Jim Zanolli President of Teka Interconnection Systems looks forward to leading a discussion regarding assembly methods for through-hole connectors on mixed technology PCB assemblies.
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Moderator: Jeff Schake
Topic: A discussion focused on stencil printing issues with 0201 technology.
When: Discussion originally held on September 17, 2001
Description: Jeff Schake is Senior Advanced Technologies Engineer for DEK Printing Machines Ltd. He will lead a discussion focused on stencil printing issues with 0201 technology.
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Moderator: Jay Hinerman
Topic: Current tooling options available to manufacturers of PCBs, and the many important items to look for in all of the various options currently available.
When: Discussion originally held on July 30, 2001
Description: Jay , the Ovation products applications engineering manager, looks forward to leading a discusion revolving around current tooling options available to manufacturers of PCBs, and the many important items to look for in all of the various options currently available.
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Moderator: Gil Zweig
Topic: X-Ray Inspection.
When: Discussion originally held on June 18, 2001
Description: Gil Zweig , developer of Glenbrook Technologies patented X-ray camera technology, will lead a discussion regarding X-ray inspection systems.
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Moderator: Eyal Duzy
Topic: High speed in-line AOI with 3D imaging.
When: Discussion originally held on May 7, 2001
Description: Eyal Duzy is the Global Product Marketing Manger of Orbotech Assembly Division. Eyal looks forward to leading a discussion regarding the benefits of using high speed in-line AOI with 3D imaging.
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Moderator: Bill Schreiber
Topic: Issues associated with cleaning SMT stencils, misprinted PCBs and related tooling.
When: Discussion originally held on February 19, 2001
Description: Bill Schreiber looks forward to fielding questions regarding environmental, health, safety and efficacy issues associated with cleaning SMT stencils, misprinted PCBs and related tooling used in the SMT printing process.
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Moderator: Jason Spera
Topic: Manufacturing software in the SMT industry.
When: Discussion originally held on January 22, 2001
Description: Jason Spera is the chief executive officer and co-founder of Aegis Industrial Software Corporation. He looks forward to fielding question regarding the use of manufacturing software in the SMT industry from January 22nd through January 26th.
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Moderator: Charles A. Harper
Topic: A discussion based upon his new book High Performance Printed Circuit Boards.
When: Discussion originally held on December 18, 2000
Description: Charles Harper , of Technology Seminars, Inc., will lead a discussion based upon his new book High Performance Printed Circuit Boards from December 18th through December 20th. Issues for discussion include advances in materials, design of high performance circuit boards, and flexible circuits for advanced electronic systems.
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Moderator: Robert Abell
Topic: Obtaining, training, re-training, re-certifying, and retaining staff for manufacturing operations.
When: Discussion originally held on November 27, 2000
Description: Robert Abell , of Rovell Enterprises, will host the upcoming November Onboard Forum. Issues for discussion are obtaining, training, re-training, re-certifying, and retaining staff for manufacturing operations
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Moderator: Paul Vianco
Topic: A discussion based upon his book: Soldering Handbook - Third Edition.
When: Discussion originally held on October 24, 2000
Description: Paul T. Vianco of Sandia National Laboratories and author of the Soldering Handbook - Third Edition (published by the American Welding Society) will be the moderator of our next OnBoard Forum scheduled for late-October.
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Moderator: Erick Russell
Topic: The development of photonic soldering equipment, research and development of future laser products.
When: Discussion originally held on September 18, 2000
Description: Erick Russell is Product Manager for Laser Soldering Products at ViTechnology. His work includes the development of photonic soldering equipment, research and development of future laser products and customer support for the installed base of ViTechnology products.
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Moderator: Dr. Ning-Cheng Lee
Topic: Fluxes and solder pastes for SMT industries.
When: Discussion originally held on August 22, 2000
Description: Dr. Lee is the Vice President of Technology of Indium Corporation of America and inventor of the world's leading No-Clean Solder Paste NC-SMQ92. Prior to joining Indium in 1986, he was with Morton Chemical and SCM. He has more than 16 years of experience in the development of fluxes and solder pastes for SMT industries.
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Moderator: Bob Willis
Topic: Pin In Hole Reflow, his new process of Simultaneous Double Sided Reflow Assembly, Lead-Free Solder, or any process related subject.
When: Discussion originally held on July 20, 2000
Description: Bob Willis operates Electronic Presentation Services, a training and consultancy business based in England and operating world wide. He worked with the GEC Technical Directorate as Surface Mount Coordinator for both the Marconi and GEC group of companies and prior to that he was Senior Process Control Engineer with Marconi Communication Systems.
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Moderator: Lee H. Goldberg
Topic: Iinternational policy issues such as achieving ISO 14000 compliance, material selection, manufacturing concerns like no-flux, no-lead processes, and design issues.
When: Discussion originally held on June 22, 2000
Description: Topics open for this OnBoard discussion, with Lee Goldberg , include international policy issues such as achieving ISO 14000 compliance, material selection, manufacturing concerns like no-flux, no-lead processes, and design issues such as reducing power consumption and designing for recyclability.
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Moderator: Charles A. Harper
Topic: A discussion based upon his book: Electronic Packaging and Interconnection Handbook.
When: Discussion originally held on June 6, 2000
Description: The 3rd edition of Mr. Harper's Electronic Packaging and Interconnection Handbook covers all areas of electronic packaging, from fundamentals to latest technologies. Applauded by most of the leading technical journals in this field. A truly practical multi-discipline treatment.
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