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News from KYZEN Corporation


Kyzen’s Cleaning Flux Residues Presentation Wins a Best Paper Award at SMTA China East Conference

May 19, 2011

Kyzen, a world leading provider of environmentally responsible precision cleaning products for electronics and high-technology manufacturing operations, announces that it received the Best Paper of Technology Conference Two (CE11) award for the presentation titled  “Correlation Study for Cleaning Flux Residues under Component Gaps.”  The award was accepted during a ceremony held on Thursday, May 12, 2011 at the Shanghai Everbright International Hotel in conjunction with the SMTA China Fifth Anniversary Gala Dinner.

“I would like to express my appreciation for the team effort to continually bring new and interesting technical articles and presentations to these events,” said Phil Zhang, China Sales manager.

The paper was presented by Zhang on May 11.

Cleaning flux residues from under component gaps has become extremely challenging due to the nature of the flux residue, under component clearance from the board to the bottom of the component, time required for the cleaning agent to penetrate the gap, the cleaning agents ability to solvate and break the flux dam needed to create a flow channel, and the mechanical energy needed to deliver the cleaning agent to the flux residue. Flux residues that form a hard shell require longer wash times to dissolve in the cleaning agent, thus requiring increased time to clean these residues under the component gaps. Zhang’s presentation discussed the correlation of cleaning all flux residues under the component as a function of the gap height.


Kyzen is a leading supplier of precision cleaning chemistries to the worldwide electronics, metal finishing, medical, semiconductor, and optical industries. Founded in 1990, Kyzen offers superior cleaning chemistries, technical support, application and analytical services throughout the world. Kyzen has won numerous industry awards for their exceptional products and all products are RoHS compliant.

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