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MARTIN to Demonstrate BGA Reball/Pre-Bump Unit at the SMTA Space Coast Expo & Tech Forum

May 10, 2011

Mini-Oven 04 Reball/Prebump unit

Mini-Oven 04 Reball/Prebump unit

MARTIN will showcase its Mini-Oven 04 Reball/Prebump unit at the upcoming Space Coast Expo and Tech Forum, scheduled to take place June 9, 2011 at the Melbourne Auditorium in Melbourne, FL.

Ideal for the complete QFN solder bumping process, down to the smallest pitches, MARTIN's Mini-Oven 04 Reball/Prebump unit uses a unique Hotprint Technology where the mask is not removed after printing paste but remains on the QFN during reflow.

The reballing function can handle a diverse range of BGAs, as well as QFNs and CSPs. Additionally, processes can be completed in as little as three minutes. The simple Rapid Technology soldering profiles rigorously apply settings within the permitted thermal limits, heat at the highest advisable thermal ramp rates and maintain a safe temperature zone.

The unit provides programmable modes and a nitrogen process gas supply. Also, up to 99 profiles can be accommodated, with the ability to edit individual profiles and fine tune parameters.

For further information, visit MARTIN at the SMTA Space Coast Expo & Tech Forum or online at http://www.bgarework.com.


MARTIN has developed affordable rework, BGA reballing, hand soldering, and dispensing technologies for nearly 30 years. The USA sales and service office is located in Manchester, NH. The company‘s manufacturing facility is in Wesseling, Germany. MARTIN is a FINETECH company which produces advanced rework and bonding platforms for complex applications.

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