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SMTA Capital Chapter Meeting – Soldering Challenges in a Halogen-Free PCB Assembly Process

Apr 22, 2011

The Capital Chapter is announcing its next SMTA meeting to be held at APL, Johns Hopkins University, in Laurel MD on May 17, 2011 from 5pm-8pm.

Christopher Nash, Technical Support Engineer with Indium Corporation is an expert in the field of the selection, use, and application of solder paste, flux, and solder alloy fabrications and provides comprehensive technical advice to customers in the electronic assembly, optoelectronic, semiconductor, and related industries.

Chris will be speaking about new soldering challenges a halogen-free PCB assembly process can undergo. The presentation will explain the difference of halogen-free vs. halide-free, name the key industry specifications for HF as well as cover the typical problem a HF process might encounter.

SMTA Capital Chapter Meeting is scheduled as follows:

5:00 - 5:30 Sign in and Networking

5:30 - 6:15 Dinner (Survey for future meetings)

6:15 - 7:15 Chris Nash, Indium Corporation - Soldering Challenges in a Halogen-Free PCB Assembly Process

7:15 - 8:00 Q&A, Networking

Registration fees:

Members: $20

Non Members: $30

To register for this event as well as any upcoming ones or for more information about the SMTA, please visit http://www.smta.org or click on the link below:

http://www.smta.org/chapters/rsvp.cfm?BEE_ID=2536&BULK_EMAIL_NO=1


25 Years Developing Solutions in Electronics Assembly

The SMTA (http://www.smta.org) membership is an international network of professionals who build skills, share practical experience and develop solutions in electronic assembly technologies, including Microsystems, emerging technologies, and related business operations.

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