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New Industrial Products to Hit NEPCON China 2011

Apr 22, 2011

Statistics indicate that China's electronics and information manufacturing industries in 2011 show a good start with steady growth. Its added value grew by 14.3 percent in the first two months, 0.2 percent higher than China’s industrial average, and accomplished a sales value of RMB970.6 billion Yuan, a year-on-year rise of 21.6 percent. Meanwhile, Investments in 11 segments of the electronics and information manufacturing industry maintain a growth of more than 35 percent, among which, the growth of communication equipments, computers, electronic devices and mechanical and electrical information segments exceed 50 percent.

Together with the steady development of China’s electronics and information products market, many famous global manufacturers hasten to promote new products in China. NEPCON China, as one of the most important trading platforms of China’s electronics manufacturing industry for multinational and domestic purchasing, has become the preferential platform for manufacturers to release their new products. May 11 will see the grand opening of NEPCON China 2011 at the Shanghai Everbright Convention and Exhibition Center, with various renowned exhibitors, including Siemens, Fuji, Agilent Technologies, Samsung, Tokyo Juki, Europlacer, DEK, BTU, Henkel etc., promoting their newly-released products and technology in China or Asia, and their new technologies and processes.

Steady growth of the market brings many opportunities to manufacturers, but also new requirements and directions. In the wake of industrial development, NEPCON China 2011 will unveil to its audience the latest industrial technical achievements and developments in high performance, energy saving, innovation, green and environmental protection. By combining almost all of the new technologies, products and business information in the SMT industry, it will be an opportunity that you cannot afford to miss.

Focus on Hot LED Applications

The tendency of LED lighting to replace the traditional ways has been widely acknowledged, demonstrated by the fast development of LED technology and applications at home and abroad. Certainly, domestic and foreign manufacturing powers will grasp NEPCON China’s invaluable opportunity to launch their newest products. Europlacer’s dual-head iineo-II VLB is the latest enhancement to the Europlacer product portfolio, providing unrivalled PCB dimensions and is capable of handling oversized PCBs up to 1610 x 600 mm with a placement rate up to 27,300 cph. The vision algorithm developed by Europlacer can detect the correct orientation of the LED, which is fairly standard. Evest’s EM series supports LED light bar mounting. The light bar length can be up to 1.5 m, UPH up to 20,000 (IPC 9850). The EM series - LED version, has a built-in LED shape recognition module, which saves the component pattern building time. Additionally, the need to improve LED manufacturing test productivity and coverage is ever-increasing. Agilent will highlight the Agilent Test Coverage Consultant software tool, as well as its new 08.20p software for the i3070, which provides high-power testing capabilities.

Strive for High Performance

High performance always serves as the primary goal for manufacturers. To satisfy the market demand for huge product volume and diversified requirements, manufacturers continually relegate the old and bring forth the new to hold the edge in the competition. Fuji will present the new AIMEX ― a mounting system that supports production from trial runs and high-mix/low-volume to mass production. The AIMEX inherits a variety of options from the NXT-series and uses the same placement heads, making it a truly scalable all-in-one machine. JUKI will showcase a variety of new machine models and products with enhanced new functions. The speed of the FX-3R has increased by approximately 20 percent in comparison to the FX-3, which also will feature prominently. JUKI also will exhibit the small-size chip mounter JX-200 with image recognition, which also can mount FBGA with irregular components.

Technical Innovation to Promote Development

Innovation, the main motivation of which is to increase productivity, is always a goal for the industry to focus on and pursue. Thus, during NEPCON China 2011, breakthroughs in products, innovation and technique advances will be introduced to the audience. For example, Henkel will introduce Macromelt ― a robust, environmentally friendly alternative to traditional potting and injection molding encapsulation techniques, which can be chaotic, time consuming and may potentially damage sensitive devices because of the pressure required for complete encapsulation. The polyamide hot melt material quickly encapsulates exposed circuitry to form the outer shell of the device, thus delivering a self-contained integrated assembly. KIC’s RPI Automatic Reflow Inspection inspects and verifies that each and every PCB assembly adheres to established reflow process specifications. Any PCB processed out of spec gets diverted into the RPI magazine loader. These PCBs require special attention and can be rerouted to Batch X-ray or other forms of analysis.

Green Storm for Environmental Protection

“Environmental Protection,” which has received extensive attention in recent years, has greatly influenced the development patterns and directions of manufacturing, which also is confirmed by NEPCON China 2011. For example, Nihon Superior Co. Ltd. will introduce its new halogen-free products, SN100C P603 D4 and SN100C P605 D6 dispensing grade completely halogen-free lead-free solder pastes. These offer superior dispensing stability, which ensures no skipped pads. SN100C P605 D6 is optimized for high-precision dispensing for chip components down to 01005 (0402 metric). BTU International will introduce its new patented flux management system. It not only inherits the benefits found in the original design, but it also is easier to handle and clean, and collects flux more effectively. The "new" flux management helps users lower maintenance frequency, increase uptime and reduce service time.

The Green Electronics Design and Manufacturing segment will be set up during NEPCON China 2011 to exhibit green, energy-saving, and environmental equipment, products and services. It will cover four main types of exhibitions: Green Electronics Recycling, Quality Control, Automation and ESD. For the first time, domestic and foreign suppliers of green electronics design and manufacturing will exhibit products and services featuring environmental protection through this platform.

NEPCON China will cover an estimated area of 32,000 m2, with 18,000 industry personalities gathering together. Approximately 500 exhibitors from 22 countries and regions will participate, with more than 1000 electronics manufacturing equipment and consumables to be exhibited onsite.

To find out more about NEPCON China 2011, visit http://www.nepconchina.com


Reed Exhibitions is the world’s leading events organizer, with over 460 events in 36 countries. In 2010 Reed brought together over seven million event participants from around the world, generating billions of dollars in business. Today Reed events, organized by 34 fully staffed offices, are held throughout the Americas, Europe, the Middle East and Asia-Pacific.

Reed organizes a wide range of events, including trade and consumer exhibitions, conferences and meetings. Its portfolio of over 460 events serves 44 industry sectors, including: aerospace & aviation, automobiles, beauty & cosmetics, broadcasting, building & construction, electronics, energy, oil & gas, engineering & manufacturing, food service & hospitality, gifts, healthcare, interior design, IT & telecoms, jewelry, life sciences & pharmaceuticals, machinery, marketing, business services & training, medical education, printing & graphics, security & safety, sports, recreation and travel.

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