Top manufacturers choose NEPCON China 2011 as their primary platform for new product releases in Asia.
China's Twelfth Five-Year Plan (2011-2015) calls for the manufacturing of advanced equipment to accelerate its development. The Ministry of Industry and Information Technology predicts that the added value of the electronics information manufacturing industry is expected to increase by approximately 15 percent in 2011.
NEPCON China 2011 will be held at the Shanghai Everbright Convention & Exhibition Center from May 11-13. This year’s event will welcome an additional 100 new exhibitors. The exciting prospects of China’s electronics manufacturing industry has made the country a prime market for numerous well-known electronics manufacturers, locally and internationally. For this reason, makers of electronics will use NEPCON China 2011 as a platform from which to launch new products in Asia.
Siemens: Smart SIPLACE DX
The SIPLACE team from Siemens Electronics Assembly Systems (SEAS) will introduce its smart SIPLACE DX to the Chinese market at NEPCON China 2011. The brand new SIPLACE DX uses state-of-the-art technology and several intelligent features to help users achieve optimal performance.
The SIPLACE DX integrates numerous new technologies, including a high-speed 20-nozzle mount head, linear motor technology in full-closed loop control, smart feeder, easy-to-use workstation software on SMT placement machines, powerful new software systems and an always-online tray feeder. The high-speed 20-nozzle Collect & Place head for 01005 mass production and closed-loop linear motor drive technology for all axes are other key features.
Panasonic: New Multifunction Production System
The NPM-W is a new modular production system that inherits the high-productivity and flexibility of the popular NPM-D.
The NPM-W provides a new feature ― free-combination of various heads, e.g. placement heads, dispensing heads and inspection heads ― in addition to adaptability to various substrates and components.
NPM-W enhances its production adaptability to accommodate long substrates for LED production and a large number of feeder input for the AV and automotive industries, as well as easy changeover.
Customers can choose the type of conveyor, single/dual-land, as well as component supply style, tape feeder or single/twin tray feeder, allowing NPM-W to realize a suitable production line for customers’ various products.
Nutek: New Ink-Jet Marking System
Nutek Private Limited will introduce a new ink-jet marking system, Nutek, which is designed to accurately label circuit boards using a high-resolution ink-jet printer. This model supports online and standalone modes.
The machine drives its ink-jet printer to a location for labeling by locking the circuit board in a certain position and controlling operation on the X-Y track. Its Windows™ software system is easy to use and facilitates labeling location and frequency definition.
Fuji: New AIMEX Placement System
Fuji has developed a placement system, AIMEX, to facilitate the shift from sample production to short-run production and even mass production. The all-in-one system uses several optional units like the mount head from the NXT series. Due to the extension capability of its placement mechanical axes, it can readily adapt to changes in customer output and project content.
Cookson: New Halogen-Free Liquid Flux
Cookson Electronics will display a new flux: ALPHA®EF-6850HF. It is halogen-free, low solid, alcohol-based and requires no cleaning. The flux is designed for wave soldering, selective soldering and reworking. Its unique formulation supports the application of high-density printed boards in both the tin-lead and no-lead soldering fields, while its excellent soldering performance is widely recommended by OEMs and electronics manufacturers worldwide.
The ALPHA® EF-6850HF is environmentally friendly and complies with halogen-free industry standards. Its unique activator package produces highly reliable assemblies with excellent cosmetics with a uniform, tack-free residue and pin testability. The ALPHA® EF- 6850HF flux also offers excellent low bridging and low solder ball results. Its low surface tension allows for high through-hole penetration and uniform SMT pad coverage, making it excellent for reliable soldering in both single and dual wave processes.
Henkel: Low Pressure Molding
The Henkel Macromelt low pressure molding is a process that may soon replace traditional injection molding and potting technologies. The hot melt polyamide is a quick, convenient solution that encapsulates a product’s circuitry while simultaneously forming the outer shell of a component. This results in a self-contained, integrated component.
Macromelt is a robust, environmentally friendly alternative to traditional potting and injection molding encapsulation techniques. The simplicity of these materials is their advantage: because the entire Macromelt operation takes place at low pressure, cycle time is short and fine or fragile circuitry is not damaged. The polyamide hot melt material quickly encapsulates exposed circuitry to form the outer shell of the device, thus delivering a self-contained integrated assembly. The process is fast, simple, cost-effective and perfect for delicate circuitry as the application pressure within the mold cavity is an incredibly low 20 to 500psi. PCB and circuitry protection is essential in modern, challenging applications; and Macromelt delivers manufacturers a proven, reliable solution.
Samsung: High-Speed LED Chip Mounter (SLM120)
Samsung's high-speed LED chip mounter provides numerous advantages including the capability of getting the highest production with one feeder. Additional benefits include that the systems can handle PCBs up to 1.2 m, regardless of small device sizes; users can use the rank management ability; downtime is reduced; and one-side operation is available.
The above items are just a snapshot of the new product launches that will be on display during NEPCON China 2011. For more exciting presentations, visit the exhibition!
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