NS-F900 is a robust, heat resistant, no-clean, rosin-based wave soldering flux that is completely halogen-free. It provides high performance with high temperature preheat profiles, allowing high topside board temperatures up to 125°C and the long contact times that may be required for thick boards and dense, complex assemblies while being environmentally friendly. NS-F900 is specifically designed for use with SN100C (Sn-Cu-Ni+Ge) lead-free solder but works well with all lead-free solders as well as Sn/Pb.
NS-F900 has been formulated to provide good hole-fill and easy solder joint inspection with minimal residue, while meeting JIS and J-STD-004 Surface Insulation Resistance requirements. The excellent drainage promoted by NS-F900 results in reduced bridging.
Premiering in 2008, the NPI Awards program is an annual celebration of product excellence in electronics surface mount assembly. Premier products based on the finest examples of creative advancement in technology are chosen by a distinguished panel of industry experts.
Nihon Superior was founded in 1966 when it began marketing unique flux products imported from the US. The company made its mark on society by gathering the most advanced soldering and brazing technologies and products from around the world, and supplying them to companies in the metal-joining industry. A turning point for the company came when it started developing its own soldering materials and with the success of its unique SN100C lead-free solder alloy Nihon Superior has become a major player in the global market. To support the growing demand for its products Nihon Superior has established manufacturing and sales centers in Japan, China and other Asian countries and formed business partnerships with companies in other markets.