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Finetech to Exhibit at NEPCON China 2011

Apr 20, 2011

The FINEPLACER® core plus is a compact yet versatile rework system that offers a level of professionalism that exceeds its attractive price.

The FINEPLACER® core plus is a compact yet versatile rework system that offers a level of professionalism that exceeds its attractive price.

Rework station FINEPLACER® pico rs

Rework station FINEPLACER® pico rs

Finetech, a world leading equipment manufacturer of advanced rework solutions, will present two rework systems for professional rework applications in booth 2D10-A at NEPCON China 2011.

Advanced Rework Equipment on Display at German Pavilion

The FINEPLACER® core plus is a compact yet versatile rework system that offers a level of professionalism that exceeds its attractive price. The system offers proven rework technology for a wide spectrum of SMD components, ranging in size from 0201 to 70 x 70 mm.

This compact rework station is based on Finetech’s proven technology integrating the complete rework cycle into an efficient design, without diminishing functionality. The system is at home in production environments where process reproducibility is crucial. The large area under-board heater for PCBs supports board sizes of up to 400 x 310 mm.

FINEPLACER® pico rs is an enhanced hot air rework station for assembly and rework of all types of SMD components. The system is a best seller for professional mobile device rework in challenging high-density environments.

The system provides industry-leading Integrated Process Management (IPM) with synchronized control of all process modules and their related parameters: top and bottom (pre-)heating and cooling, temperature, time, power, flow, light and vacuum. Process gas can be seamlessly integrated into the reflow process for significantly improved soldering results.

FINEPLACER® pico rs features placement accuracy better than 5 µm, high-efficiency board heating, closed-loop force control as well as automated top heater calibration. The system-to-system process transfer capability allows worldwide profile allocation with highly reproducible results on all modular FINEPLACER® rework systems.

The application range contains the whole rework cycle including 01005, Package-on-Package (PoP), BGA/CSP, QFN/MLF, high-density rework and packaging of hybrid/modular electronic modules.

Visit Finetech at the upcoming NEPCON/EMT China 2011: Shanghai Everbright Convention & Exhibition Centre, German Pavilion from May 11-13, 2011.

The modular FINEPLACER® systems are offer maximum process flexibility in many different connection technologies. They include a wide variety of soldering and bonding technologies, as well as ultrasonic and thermal compression bonding. FINEPLACER® systems are used especially in R&D, prototype building and small series production.

Finetech is a leading manufacturer of equipment for manual and fully automatic circuit board repair and high-precision insertion of electronic/optical components, plus assembly and fitting of complex opto-electronic systems. The headquarters of Finetech are located in Berlin, with subsidiaries in Tempe (AZ), Shanghai and Penang / Malaysia.

Finetech's customers include companies in the aerospace, automobile, medical/bio/solar technology, optoelectronics, semiconductor, consumer electronics and defence sectors, together with education and research establishments. Finetech responds flexibly to specific requirements and offers tailor-made solutions to highly-demanding customer applications. Finetech is represented by direct subsidiaries in its core markets and offers on-site application support and advice. It is also represented world-wide by a network of agencies.

As of January 1, 2010, Finetech broadened their midrange price product range in rework by acquiring German rework and dispense specialist MARTIN GmbH of Wessling near Munich.

Apr 07, 2016 -

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May 28, 2013 -

Al Cabral Joins Finetech as Regional Sales Manager

Mar 11, 2013 -

Donated Finetech Die Bonder Installed at Pennsylvania State University

Jan 16, 2013 -

Finetech to Exhibit the Ideal Blend of Performance and Cost Rework Technology at the 2013 IPC APEX EXPO

Jan 04, 2013 -

Finetech to Exhibit Sub-micron Die Bonder at SPIE Photonics West

Oct 03, 2012 -

The Best in Rework Technology – Finetech to Exhibit FINEPLACER® Core Rework System at SMTA International

Sep 26, 2012 -

MARTIN to Demonstrate Mini-Oven Reball/PreBump Unit at the Mississauga EPTECH Electronics Show

Sep 10, 2012 -

MARTIN to Participate in Package on Package (PoP) Design and Assembly Center SMTA International 2012

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