With the growing demand for high-end 3-D solder paste inspection, Viscom and CyberOptics have determined that their combined technologies create a perfect fit in completing Viscom’s product line. CyberOptics has an established 3-D SPI sensor technology leadership reputation in the SMT market with more than 3000 3-D SPI systems sold. Viscom reflects 25 years of providing several thousand high-end AOI and AXI solutions to an established worldwide customer base especially in the automotive and industrial electronics market. The partnership of these two strong players allows access to the growing global SPI needs of important market segments.
The cooperation with CyberOptics puts Viscom into a position to provide a high-speed 3-D solder paste inspection system to Viscom’s core market and to open new market segments. Volker Pape, co-founder of Viscom, states, “We thoroughly analyzed the market for 3-D sensor technology and discovered that CyberOptics’ sensor technology and engineering resources as well as their management experience in handling OEM sensor projects could provide the best matching solution for Viscom’s demanding product requirements.” He continues, “The strategic partnership offers the best solution to our customer base. It perfectly fits into our elaborated system and software structure and gives us the capability to adapt to the highest demands in the market.”
“This partnership follows CyberOptics’ strong tradition of supplying both OEM sensing solutions to leading SMT equipment vendors and to supply inspection solutions direct to customers in the SMT market,” said Kitty Iverson, CyberOptics CEO. “This partnership signifies an important milestone in the resurgence of CyberOptics as a leader provider of innovative and advanced SMT sensing solutions to the market.”
By integrating a proven high-speed, advanced 3-D SPI sensor into the wide range of capable AOI and AXI systems in Viscom’s product portfolio, Viscom is now able to offer superior inspection solutions at every in-line test gate in the electronics assembly process. Viscom’s universal software allows the operator to program all systems using the same interface and uses unique features like the SPI-AOI process uplink. This SPI-AOI or SPI-AXI uplink supports the classification at the AOI test gate by correlating SPI result data with solder joint analysis.
The first available Viscom solution with the CyberOptics SE500 sensor head is the Viscom S3088 SPI. “Integration work was fast and easy, as our software offers all the features needed to evaluate a 3-D sensor signal and to easily generate inspection programs. It took less than three months from start of integration to a full-speed running prototype,” Peter Krippner, head of Viscom’s serial product division, mentioned. “It gives the results we expected and fits perfectly into our highly standardized system platform. After the field test phase has finished, production rollout of the S3088 SPI will start in June 2011.”