SMT, PCB Electronics Industry News
  • SMTnet
  • »
  • Industry News
  • »
  • Viscom and CyberOptics Announce Cooperation Agreement for 3-D Solder Paste Inspection Sensor Technology

Viscom and CyberOptics Announce Cooperation Agreement for 3-D Solder Paste Inspection Sensor Technology

Apr 07, 2011

Viscom’s S3088 SPI

Viscom’s S3088 SPI

Viscom AG, Hannover, Germany, and CyberOptics Corp., Minneapolis, MN, USA, jointly announce an OEM agreement to equip Viscom's SPI inspection systems product line with CyberOptics' 3-D SPI sensor technology. The development and supply agreement allows for the integration of CyberOptics SE500 sensor technology into the Viscom PCB inspection platforms. Viscom's S3088 SPI with the CyberOptics SE500 sensor will be shown at the upcoming 2011 IPC APEX EXPO in Las Vegas, the SMT show in Nuremberg and at Nepcon Shanghai.

With the growing demand for high-end 3-D solder paste inspection, Viscom and CyberOptics have determined that their combined technologies create a perfect fit in completing Viscom’s product line. CyberOptics has an established 3-D SPI sensor technology leadership reputation in the SMT market with more than 3000 3-D SPI systems sold.  Viscom reflects 25 years of providing several thousand high-end AOI and AXI solutions to an established worldwide customer base especially in the automotive and industrial electronics market. The partnership of these two strong players allows access to the growing global SPI needs of important market segments.

The cooperation with CyberOptics puts Viscom into a position to provide a high-speed 3-D solder paste inspection system to Viscom’s core market and to open new market segments. Volker Pape, co-founder of Viscom, states, “We thoroughly analyzed the market for 3-D sensor technology and discovered that CyberOptics’ sensor technology and engineering resources as well as their management experience in handling OEM sensor projects could provide the best matching solution for Viscom’s demanding product requirements.” He continues, “The strategic partnership offers the best solution to our customer base. It perfectly fits into our elaborated system and software structure and gives us the capability to adapt to the highest demands in the market.”

“This partnership follows CyberOptics’ strong tradition of supplying both OEM sensing solutions to leading SMT equipment vendors and to supply inspection solutions direct to customers in the SMT market,” said Kitty Iverson, CyberOptics CEO.  “This partnership signifies an important milestone in the resurgence of CyberOptics as a leader provider of innovative and advanced SMT sensing solutions to the market.”

By integrating a proven high-speed, advanced 3-D SPI sensor into the wide range of capable AOI and AXI systems in Viscom’s product portfolio, Viscom is now able to offer superior inspection solutions at every in-line test gate in the electronics assembly process. Viscom’s universal software allows the operator to program all systems using the same interface and uses unique features like the SPI-AOI process uplink. This SPI-AOI or SPI-AXI uplink supports the classification at the AOI test gate by correlating SPI result data with solder joint analysis.

The first available Viscom solution with the CyberOptics SE500 sensor head is the Viscom S3088 SPI. “Integration work was fast and easy, as our software offers all the features needed to evaluate a 3-D sensor signal and to easily generate inspection programs. It took less than three months from start of integration to a full-speed running prototype,” Peter Krippner, head of Viscom’s serial product division, mentioned. “It gives the results we expected and fits perfectly into our highly standardized system platform. After the field test phase has finished, production rollout of the S3088 SPI will start in June 2011.”

Nov 15, 2017 -

Viscom’s S3088 SPI inspection system wins Global Technology Award

Oct 12, 2017 -

Viscom at productronica with outstanding solutions for 3D AOI and 3D AXI

Oct 12, 2017 -

Viscom presents powerful 3D AOI and SPI with ultra-modern data exchange for Industry 4.0 at SMTA Guadalajara

Sep 27, 2017 -

New inspection simulator offers inspection expertise already in the planning phase

Sep 20, 2017 -

Viscom AG adopts Valor Process Preparation solution for electronics manufacturing efficiency

Sep 18, 2017 -

ACE electronics invests in high-quality 3D inspection

Sep 18, 2017 -

Viscom record earnings confirm success track

Aug 23, 2017 -

The Hermes Standard: Viscom working on first field tests

Aug 16, 2017 -

High-Performance 3D AOI from Viscom at SMTAI

May 09, 2017 -

Viscom picks up two awards in Asia for its economical 3D AOI

91 more news from Viscom AG »

Nov 17, 2017 -

Altus on the Road to Digital Factory of the Future

Nov 17, 2017 -

MicroCare Wins Prestigious Global Technology Award at Productronica 2017

Nov 17, 2017 -

Mycronic and Aegis renew partnership – FactoryLogix software to be embedded with MY700

Nov 16, 2017 -

Europlacer Unveils its New Atom Platform.

Nov 16, 2017 -

Libra Industries installs another 3D post reflow AOI system at its Dallas facility

Nov 16, 2017 -

STI Participates in Manufacturing Day

Nov 16, 2017 -

ZESTRON to Exhibit at SMTA Silicon Valley

Nov 16, 2017 -

Comet Group Receives 2017 Global Technology Award for Test Services at Lab One

Nov 15, 2017 -

WKK Distribution Honored as Best Asian Distributor

Nov 15, 2017 -

KYZEN, the Leader in Cleaning Innovation, Receives Its 60th Industry Award

See electronics manufacturing industry news »

Viscom and CyberOptics Announce Cooperation Agreement for 3-D Solder Paste Inspection Sensor Technology news release has been viewed 1136 times

  • SMTnet
  • »
  • Industry News
  • »
  • Viscom and CyberOptics Announce Cooperation Agreement for 3-D Solder Paste Inspection Sensor Technology
Reflow Oven

Fully automatic selective soldering stations