Expert presentations are sought on topics, including component selection and storage, component moisture issues, wave process, mitigating lead-free issues, reflow temperatures, test vehicles, alloy characterization, validating results, x-ray inspection, test methods/defect detection, flip chip assembly process, ball grid array issues, bottom termination component/leadless component issues, electrostatic discharge and board storage.
An abstract of no more than 300 words must be submitted by April 21, 2011, to Susan Filz, IPC director of industry programs, at SusanFilz@ipc.org. Presentations may be based on papers. Presentations should be noncommercial and emphasize new technologies, discuss trends of interest, provide insight to best practices or describe significant results from tests or experiments.
IPC (http://www.IPC.org) is a global trade association based in Bannockburn, Ill., dedicated to the competitive excellence and financial success of its 2,800 member companies which represent all facets of the electronics industry, including design, printed board manufacturing, electronics assembly and test. As a member-driven organization and leading source for industry standards, training, market research and public policy advocacy, IPC supports programs to meet the needs of an estimated $1.85 trillion global electronics industry. IPC maintains additional offices in Taos, N.M.; Arlington, Va.; Garden Grove, Calif.; Stockholm, Sweden; Moscow, Russia; Bangalore, India; and Shanghai, Shenzhen and Beijing, China.