SMT, PCB Electronics Industry News

SMT, PCB Electronics Industry News

News from Association Connecting Electronics Industries (IPC)


IPC APEX EXPO™ Highlights the Most Exciting Eleven New Products in the Show’s Innovative Technology Center

Mar 28, 2011

DEK ProActiv is a breakthrough process technology that dramatically improves solder paste transfer efficiency with stencil printing.

DEK ProActiv is a breakthrough process technology that dramatically improves solder paste transfer efficiency with stencil printing.

Seika’s new Solder Paste Recycling Unit enables approximately 90 percent of waste solder paste to be recovered as solder bar.

Seika’s new Solder Paste Recycling Unit enables approximately 90 percent of waste solder paste to be recovered as solder bar.

The Tagarno MAGNUS HD combines HD imaging with advanced microscopy to enable users to inspect products with extremely sharp images and unsurpassed color reproduction.

The Tagarno MAGNUS HD combines HD imaging with advanced microscopy to enable users to inspect products with extremely sharp images and unsurpassed color reproduction.

Eleven products have been selected for inclusion in the Innovative Technology Center at IPC APEX EXPO™, April 12–14, 2011, in Las Vegas, according to show organizer IPC – Association Connecting Electronics Industries. Assessed by a review board of industry experts, the products were selected based on their representation of a new or emerging technology of significant value and relevance to the electronics manufacturing industry. More than 250 new products have been announced by show exhibitors to date.

This year's winners demonstrated innovation in design, materials, test and assembly technology. The 2011 Innovative Technology Center will showcase:

  • Dual Nozzle Selective Soldering Feature, ACE Production Technologies, Inc. — allows two differently-sized nozzles to operate in tandem, each one individually programmable, to handle a wide range of component types and sizes on an individual PCB assembly during the selective soldering process.

  • ProActiv, DEK International — extends the print process window to a level that enables consistent printing of small apertures for 0.3mm CSPs and 01005 passives.

  • Nano-ProTek Fluxophobic Stencil Technology, DEK International — a breakthrough stencil coating technology that delivers high performance stencils in a cost-effective wipe to overcome the challenges of smaller aperture sizes.

  • Macromelt® OM341, Henkel Electronic Material LLC — a robust, environmentally friendly alternative to traditional potting and injection molding encapsulation techniques.

  • Seika Solder Paste Recycling System, Seika Machinery, Inc. — enables approximately 90 percent of waste solder paste to be recovered as solder bar.

  • Tagarno Magnus HD Inspection System, Christopher Associates — combines HD imaging with advanced microscopy to enable users to inspect products with extremely sharp images and unsurpassed color reproduction.

  • RT/duroid® 6035HTC laminate, Rogers Corporation — ceramic-filled PTFE composites for use in high power RF and microwave applications.

  • SMT 520 Low Gold Immersion Gold Plating, Dow Electronic Materials — a new immersion gold plating bath for PCB final finish designed to run at very low gold concentration and still deliver uniform dense deposits on various feature sizes.

  • MLI 3000 Series, Maskless Lithography, Inc. — uses its patented Gray Level Imaging process to produce superior side to side registration accuracy and the highest throughput in the PCB industry.

  • FLS940SXi Flying Probe Test System, Acculogic Inc. — in addition to its single-sided test capability, the system can be equipped with up to ten variable or fixed-angle probe modules.

  • QuickTest, Seica Inc. — a point and click intuitive interface that allows lower skilled operators to perform functional tests without any knowledge of ATE architecture and programming.

IPC APEX EXPO attendees will have the opportunity to view these products on the show floor and also in a special poster presentation area.

“This is the highest number of products we’ve had in the Innovative Technology Center in quite some time and we were very pleased to see all aspects of the supply chain: board design, manufacture, assembly and test represented,” says Denny McGuirk, IPC president. “Buyers are going to have a lot to look at during this year’s show.”

Members of the 2011 ITC Review Board include: Jack Fisher, Interconnect Technology Analysis Inc.; Renee Michalkiewicz, Trace Laboratories; Don DuPriest, Lockheed Martin Missiles and Fire Control; and Thomas F. Gardeski, Gemini Sciences, LLC.

IPC APEX EXPO will be held at the Mandalay Bay Convention Center in Las Vegas. For more information on all IPC APEX EXPO activities or to register, visit http://www.IPCAPEXEXPO.org. New products and details on exhibitors can be found in the online exhibit hall at http://www.IPCAPEXEXPO.org/my-show. Exhibits-only registration is free to pre-registrants and provides access to the largest electronics manufacturing exhibition in North America and free events such as a keynote session featuring Steve Wozniak, co-founder of Apple Computer, educational “buzz sessions,” technical poster sessions, a solar assembly and solar living pavilion, a process defect clinic and all free networking activities.


IPC (http://www.IPC.org) is a global trade association based in Bannockburn, Ill., dedicated to the competitive excellence and financial success of its 2,700 member companies which represent all facets of the electronics industry, including design, printed board manufacturing, electronics assembly and test. As a member-driven organization and leading source for industry standards, training, market research and public policy advocacy, IPC supports programs to meet the needs of an estimated $1.5 trillion global electronics industry. IPC maintains additional offices in Taos, N.M.; Arlington, Va.; Garden Grove, Calif.; Stockholm, Sweden; Moscow, Russia; Bangalore, India; Shanghai, Shenzhen and Beijing, China.

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