SN100C P602 D4 is completely halogen-free, which means there are no intentional additions of the halogens F, Cl, Br or even I hidden in the chemistry. The silver-free SN100C alloy delivers a stable microstructure in an alloy that can accommodate the long-term cyclic strains and impact loading to which a solder joint can be subjected.
The SN100C fillets are smooth and bright with few shrinkage defects and a stable microstructure with minimal growth of the interfacial intermetallic, resulting in highly reliable solder joints. SN100C P602 D4 provides excellent printing and reflow in fine-pitch circuitry, low hot and cold slump, and good coalescence and wetting with no solder balls.
SN100C P603 D4 and SN100C P605 D5/D6 dispensing grade completely halogen-free lead-free solder pastes offer superior dispensing stability, which ensures no skipped pads. SN100C P605 D5/D6 is optimized for high precision dispensing for chip components down to 01005(0402 metric). Being completely halogen-free, these pastes help to achieve improved reliability, high productivity and cost reduction.
SN100C (044) completely halogen-free high performance flux-cored solder wire makes it possible to achieve a high first pass yield because of its excellent wetting and spread, while providing an approximately 30 percent faster soldering speed in manual soldering when compared to the company’s previous halogen-free flux-cored solder wire.
NS-F900 is a robust, heat resistant, no-clean, rosin-based wave soldering flux that is completely halogen-free. It provides high performance with high temperature preheat profiles, allowing high topside board temperatures up to 125°C and the long contact times that may be required for thick boards and dense, complex assemblies while being environmentally friendly. NS-F900 is specifically designed for use with SN100C (Sn-Cu-Ni+Ge) lead-free solder but works well with all lead-free solders as well as Sn/Pb.
NS-F900 has been formulated to provide good hole-fill and easy solder joint inspection with minimal residue, while meeting JIS and J-STD-004 Surface Insulation Resistance requirements. The excellent drainage promoted by NS-F900 results in reduced bridging.
SN100C Lead-free BGA Solder Spheres have high impact strength, comparable to tin-lead, for BGA, CSP, MCM and other high density area-array packages. The nickel-stabilized interfacial intermetallic is free of the incipient cracking that reduces resistance to impact loading in other lead-free solders.
Nihon Superior was founded in 1966 when it began marketing unique flux products imported from the US. The company made its mark on society by gathering the most advanced soldering and brazing technologies and products from around the world, and supplying them to companies in the metal-joining industry. A turning point for the company came when it started developing its own soldering materials and with the success of its unique SN100C lead-free solder alloy Nihon Superior has become a major player in the global market. To support the growing demand for its products Nihon Superior has established manufacturing and sales centers in Japan, China and other Asian countries and formed business partnerships with companies in other markets.