Sessions on Tuesday, April 12 include two on corporate social responsibility (CSR):
Corporate Social Responsibility: Measuring Your Carbon Footprint — Panelists from Intel and Motorola are joined by other industry experts in discussing greenhouse gas tracking, carbon footprints and other CSR issues coming to the attention of consumers.
Corporate Social Responsibility: Conflict Metals — Panelists will provide the latest available information on U.S. SEC regulations requiring reporting of the source and chain of custody for tin, tantalum, gold and tungsten. In addition, industry efforts to improve transparency in the trade of conflict metals and to share data through the IPC-1752 materials declaration standard will be discussed.
Three Buzz Sessions on Wednesday, April 13 include:
Cage Match: Design for Test (DFT) vs. Design for Manufacturing (DFM) — Speakers from original equipment manufacturers (OEMs), electronics manufacturing services (EMS) companies and equipment suppliers will debate the choices and challenges in optimizing manufacturing for test or manufacture.
Overview of UL's Printed Circuit Boards Recognition Program — This presentation will describe the UL Components Program, including its purpose, importance and benefits and how it specifically applies to PCBs.
Best Practices for Intellectual Property Protection in PCB Manufacturing — Panelists from OEMs and printed board companies will highlight the issues of protecting board-level intellectual property (IP) and how IPC-1071, IPC’s new IP standard, provides a guide to industry best practices.
On Thursday, April 14, two morning BUZZ Sessions are:
Increase Reliability and Quality with the Help of IPC Standards — This session will highlight how IPC standards and training programs can contribute to excellence in quality and reliability for OEM and EMS companies.
IPC Technology Roadmap — The roadmap’s key contributors will highlight new developments for the new 2010/2011 version and how it can be used to develop business and market strategies and to validate and justify capital investment or to guide development activities.
To register or for more information on all the activities at IPC APEX EXPO, including the largest exhibition in North America for printed board design and manufacturing, electronics assembly and test, visit http://www.IPCAPEXEXPO.org.
A free Exhibits-Only registration to IPC APEX EXPO is available to pre-registrants at http://www.IPCAPEXEXPO.org/register. The Exhibits-Only registration includes free access to the exhibition, BUZZ Sessions, Solar Assembly & Living Pavilion and Process Defect Database Clinic as well as all free special events. For more information, visit http://www.IPCAPEXEXPO.org.
IPC (http://www.IPC.org) is a global trade association based in Bannockburn, Ill., dedicated to the competitive excellence and financial success of its 2,700 member companies which represent all facets of the electronics industry, including design, printed board manufacturing, electronics assembly and test. As a member-driven organization and leading source for industry standards, training, market research and public policy advocacy, IPC supports programs to meet the needs of an estimated $1.5 trillion global electronics industry. IPC maintains additional offices in Taos, N.M.; Arlington, Va.; Garden Grove, Calif.; Stockholm, Sweden; Moscow, Russia; Bangalore, India; Shanghai, Shenzhen and Beijing, China.