The Ecobrid stencil cleaner provides a 66 percent reduction in CO2 emissions and energy consumption over the previously fully automatic cleaning system, as well as a significant reduction in running costs. Additionally, the system cleans and dries in five minutes.
The fully automatic cleaner features easy-to-use touch panel operation and uses a low-VOC solvent, making it environmentally-friendly and resulting in little to no flash point concerns. As an additional benefit, the slide-in mechanism allows for ease of stencil insertion for cleaning.
Sawa Stencil Cleaners are widely used in the Japanese electronics industry to ensure high yields when screen printing solder paste onto PCBs. Normal cloth wipe cleaning of stencils cannot completely remove solder paste especially in fine-pitch applications because a small amount of solder balls have a tendency to adhere to the corners of the apertures.
For more information about Seika’s Sawa Ecobrid SC-AH100 Fully Automatic Low-VOC Stencil Cleaner, contact Seika at 310-540-7310 or stop by Booth #459 at the IPC APEX EXPO in Las Vegas from April 12-14, 2011.
Seika Machinery, Inc. (SMI) is a subsidiary of Seika Corporation, Japan and member of the Mitsubishi Global Group. SMI provides electronics manufacturers with advanced machinery, superior materials and engineering services.