SMT, PCB Electronics Industry News

SMT, PCB Electronics Industry News

News from GOEPEL Electronic

GOEPEL electronic improves in-system Programming Capability of Flash Memories

Mar 10, 2011

GOEPEL electronic announces the market introduction of another feature within the frame of the emulation technology VarioTAP®. The new option enables the utilisation of fast process-oriented communication interfaces such as LAN or USB2.0 for data transfer, in particular solving the throughput problem in programming massive Flash images. The method does not require special firmware, does without target booting and suits fully for parallelisation. The in-system programming’s cost advantage can be implemented also for larger Flash applications especially in the production process.

“For nearly all of our customer Flash component or on-chip Flash programming is an important part of the overall application. The new VarioTAP® option now provides a solution up the area of GBit images”, explains Steffen Koehler, Team Manager in GOEPEL electronic’s Emulation Group within the Boundary Scan product division. “At the same time, we shift previous application limitations of in-system programming in the production to the traditional operating fields of expensive in-line programmer.”

Basically, the VarioTAP® option combines the efficient access of JTAG emulation with the speed of an in-application programming via a fast communication interface. By means of VarioTAP®, an existing processor is converted to a native design embedded test and programming controller. In addition to Boundary Scan (IEEE 1149.x), the method named Processor Emulation is currently the most modern in the area of embedded access technologies. It enables functional at-speed tests of chips, boards and complete systems as well as programming of on-chip Flash and Flash components of any technology.

You must be a registered user to talk back to us.

More News from GOEPEL Electronic

Oct 13, 2015 -

Goepel Presents Free Webinar on Quality Control of Plug-in Contacts Using 3D Measurement

Jul 20, 2011 -

eXception integrates GOEPEL electronic's Boundary Scan into Teradyne Test Station

Jul 13, 2011 -

GOEPEL electronic supports Picochip in testing next Generation 'Small cell' Baseband chips

Mar 22, 2011 -

GOEPEL electronics runs 9th UK Technology Day in 2011

Mar 10, 2011 -

GOEPEL electronic improves in-system Programming Capability of Flash Memories

Mar 09, 2011 -

GOEPEL electronic extends BSDL Testbench to Multi Chip Modules and 3D Chips

Mar 03, 2011 -

Cooperation between GOEPEL electronic and DM&P enables new Test Strategies for x86 System-On-Chip

Feb 26, 2011 -

Fast Generation of production-oriented AOI Programs

GOEPEL electronic improves in-system Programming Capability of Flash Memories news release has been viewed 851 times

Plasma Prior to Conformal Coating

How FactoryLogix Helped Sparton Corp. Achieve Regulatory Compliance