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CyberOptics to Debut Its Latest Inspection Solutions at electronicAmericas 2011

Mar 01, 2011

The innovative QX500™ AOI system is designed with a unique image acquisition solution – Strobed Inspection Module (SIM), bringing forth yet another industry-leading, high-speed inspection solution matched with exceptional defect coverage and an extremely low false failure rate.

The innovative QX500™ AOI system is designed with a unique image acquisition solution – Strobed Inspection Module (SIM), bringing forth yet another industry-leading, high-speed inspection solution matched with exceptional defect coverage and an extremely low false failure rate.

CyberOptics Corporation (Nasdaq: CYBE), a leading SMT inspection solutions provider, announces that it will showcase its award-winning QX500™ AOI system and robust SE350™ SPI at the upcoming electronicAmericas conference and exhibition, scheduled to take place March 28-April 1, 2011 at Anhembi Park in São Paulo, Brazil. Cyberoptics’ representative in Brazil, HiTech, invites all attendees to visit booth #J81 for a firsthand demonstration of CyberOptics’ inspection systems.

"CyberOptics is excited to be displaying our newest AOI and SPI machines in Brazil. This market has been our biggest growth area for the last two years, and this exhibition gives us an opportunity to demonstrate our best-in-class inspection systems for an even broader set of customers," commented Chris Rockwell, Director of Sales – Americas.

CyberOptics' innovative QX500™ AOI system is designed with a unique image acquisition solution – Strobed Inspection Module (SIM), bringing forth yet another industry-leading, high-speed inspection solution matched with exceptional defect coverage and an extremely low false failure rate.

The introduction of strobed white lighting in the QX500™ makes it the only AOI system to provide 'on-the-fly' area-scanning inspection at an incredible 200 cm²/sec, setting it apart from other conventional AOI systems. The QX500™’s dual fixed-angle lighting provides superb image quality for advanced automated inspection of solder and lead defects, presence and position, correct part and polarity for inspection down to 01005 components.

SE350™ is the latest addition to CyberOptics’ 3-D solder paste inspection system portfolio. The simple and robust SE350™ is equipped with CyberOptics’ calibration-free 3D sensor technology to inspect even the most demanding assemblies. The sensor is an integrated assembly designed with no moving parts, eliminating machine-to-machine variation across production lines while offering the lowest cost of ownership in the industry. Leveraging on development efforts of the SE500™, this system is capable of inspecting pad sizes down to 01005 component size (150 x 150 μm).


Founded in 1984, CyberOptics (http://www.cyberoptics.com) is a recognized leader in process yield and throughput improvement solutions for the global electronics assembly and semiconductor capital equipment markets. Headquartered in Minneapolis, MN, CyberOptics conducts operations in North America, Asia and Europe.

The Hitech (http://www.hitech.com.br) team has more than 36 years of experience supplying the Brazilian electronics market with leading international brands in the areas of electronic components, especially integrated circuits; machines for electronics assembly, testing and measurements; electronic design automation software; plastic card manufacturing equipment and equipment for printed circuit board fabrication.

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