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SMTA International Conference on Soldering and Reliability Program Announced

Feb 24, 2011

Minneapolis, MN - The SMTA is pleased to announce the program for the 2011 International Conference on Soldering and Reliability being held May 3-6 in Toronto, Ontario, Canada.

Following on the very successful 2005 and 2006 International Conferences on Lead-free Soldering, and the SMTA International Conference on Soldering and Reliability held in Toronto since 2007, this conference will bring together the community of soldering and reliability experts. The event will be co-located with the SMTA Lead-Free Academy and the SMTA Toronto Expo.

Technical conference speakers will represent IBM Corporation, Celestica, Nihon Superior, Binghamton University, Ryerson University, University of Toronto, CALCE, and many other companies and schools. Irene Sterian, Celestica, Inc., will deliver the featured Keynote Presentation "Alternative Energy Sources and What It Means to the Electronics Industry" on Thursday, May 5.

The SMTA Lead-Free Academy, Tuesday, May 3, will feature the following half-day tutorials:

  • 2nd Generation Lead Free Alloys: Is SAC the Best We Can Do?

  • Solder Joint Reliability - Failure Mode and Root Cause Analyses (Fatigue, Brittle Fracture, ENIG)

  • High Reliability: Solving Problems with Reliability in the Lead-Free Era

  • Solder Joint Reliability - Acceleration Models, Accelerated Reliability Tests and Screening Procedures

For more information or to register visit:

http://www.smta.org/icsr

Contact Patti Hvidhyld at 952-920-7682 or patti@smta.org with questions.

The SMTA membership is an international network of professionals who build skills, share practical experience and develop solutions in electronic assembly technologies, including microsystems, emerging technologies, and related business operations.

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