SMT, PCB Electronics Industry News

Seminar: Printing Process & Vapor Phase Soldering Process

Feb 18, 2011

WEST PENN CHAPTER ANNOUNCEMENT

Please join us for our 2011 kick-off meeting! We have two topics we hope you find of value. SMT solderpaste printing has more challenges today with CSPs, QFNs, 0201 & 01005 small chip components, etc..... Vapor phase soldering has unique process advantages compared to forced convection reflow. There’s a lot to learn at this meeting. We hope to see you there. Please confirm as soon as possible as we expect to fill this meeting.

Topics: "SMT Solderpaste Printing Process- the basics to advanced applications"

"Modern Vapor Phase Reflow Soldering Process- why its coming back "

Speakers: Speakers: “SMT Solderpaste Printing Process” – Ed Nauss – applications engineer- SpeedlineTech- MPM

“Modern Vapor Phase Reflow Soldering Process” – Jochen Lipp - CEO, IBL Technologies

Here's what attendees will learn:

Solderpaste Printing Process,

Key elements for a successful Stencil Printing process

Solder paste compositions: types and sizes

Matching paste to the application: fine pitch and BGAs

Correct Stencil design

Accuracy of Paste location

Vapor Phase Reflow Soldering Process,

Modern vapor phase soldering process does not have thermal shock

There is no overheating of components with modern vapor phase soldering process

Low voiding in solder joints since soldering is done in an inert atmosphere

Modern vapor phase soldering process offers a vacuum process chamber option for super low voiding

In a modern vapor phase soldering process you can reflow solder both Sn/Pb and Pb Free PCBAs without having to change fluids

There is absolute process control in the soldering processes- the process is in control by the chemistry

The environmental impact of modern vapor phase is very low- fluid safe enough to drink, lower electrical consumption, no exhausting of hot toxic fumes into the atmosphere, much reduced impact of HVAC requirements on the factory floor

When: Friday, Feb25th 2011

Time: 9:30-10:30AM – Registration/Networking w/ coffee and soft drinks

10:30-12:00AM – "SMT Solderpaste Printing Process- the basics to advanced applications"

12:00-1:00PM – Lunch will be served

1:00-2:30PM – "Modern Vapor Phase Reflow Soldering Process- why its coming back"

2:30-3:00PM – Open discussion/Questions

Place: Holiday Inn Monroeville

2750 Mosside Blvd.

Monroeville, PA 15146

412-717-9430

www.holidayinn.com/monroeville

Cost: $35 SMTA Members, $55 for potential members (remember it is only $75 for a membership). Potential members that join at the meeting can attend this meeting for free. Pay with Cash or Check at Registration. Join on-line the day before or during registration with your credit card. Become a member today! http://www.smta.org/membership/membership_step_1.cfm.

This is a lunch meeting and we will need to have everyone who is planning to attend register prior to the meeting. Please RSVP by not later than Tuesday, February 22nd. To register, please contact Ivan Ivanov at iivanov@pennatronics.com (724 938-1800 x228) or register on-line using the RSVP link below. Remember to bring a co-worker and bring your boss! Your registration is a commitment.

To RSVP, please click here, or copy and paste the following address into your web browser:

http://www.smta.org/chapters/rsvp.cfm?BEE_ID=2459&BULK_EMAIL_NO=2

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