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MARTIN to Demonstrate BGA Reball/Pre-Bump Unit at the SMTA Dallas and Houston Expo & Tech Forums

Feb 17, 2011

BGA Reball/Pre-Bump Unit

BGA Reball/Pre-Bump Unit

MARTIN will showcase its Mini-Oven 04 Reball/Prebump unit at the upcoming SMTA Dallas and Houston Expo & Tech Forums. The SMTA Dallas Expo & Tech Forum is scheduled to take place Tuesday, March 1, 2011 at the Richardson Civic Center in Richardson, TX and the SMTA Houston Expo & Tech Forum is scheduled to take place Thursday, March 3, 2011 at the Stafford Centre in Stafford, TX.

MARTIN’s Mini-Oven 04 Reball/Prebump unit is ideal for the complete QFN solder bumping process, even for the smallest pitches. Using a unique Hotprint Technology, the mask is not removed after printing paste, but remains on the QFN during reflow.

The reballing function is capable of handling a diverse range of BGAs, as well as QFNs and CSPs. Processes can be completed in as little as three minutes. The simple Rapid Technology soldering profiles rigorously apply settings within the permitted thermal limits, heat at the highest advisable thermal ramp rates and maintain a safe temperature zone.

The unit offers programmable modes and a nitrogen process gas supply. Up to 99 profiles can be accommodated, with the ability to edit individual profiles and fine tune parameters.

For further information, visit MARTIN at the SMTA Dallas and Houston Expo & Tech Forums or online at http://www.bgarework.com.

MARTIN has developed affordable rework, reballing, hand soldering and dispensing technologies for nearly 30 years. The USA sales and service office is located in Manchester, NH. The company‘s manufacturing facility is in Wesseling, Germany. MARTIN is a FINETECH company that produces advanced rework and bonding platforms for complex applications.

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