Papers should describe significant results from experiments, emphasize new techniques, and contain technical, economic or appropriate test data. Materials should be original, unpublished and non-commercial in nature.
Papers are being solicited in the following categories:
- Advanced Packaging/Components
- Emerging Technologies
- Harsh Environment Applications
- PCB Technology
- Process Control
Abstracts (300 words) are due February 28, 2011. Proposals are also solicited from individuals interested in teaching educational courses related to surface mount technology, advanced packaging, and electronics manufacturing. Course length may be half-day or full-day, and these proposals must also be submitted by February 28, 2011.
Speakers and participants benefit by making contributions to the industry and through recognition by colleagues for sharing research work and findings. To reward exceptional achievement, $1,000 and a recognition plaque are given for the "Best of Conference Presentation," "Best of Proceedings Paper," and "Best International Paper."
The SMTA membership is an international network of professionals who build skills, share practical experience and develop solutions in electronic assembly technologies, including microsystems, emerging technologies, and related business operations.