The system features numerous advanced technology features including ultra-high resolution: horizontal (10 µm/20 µm interchangeable) and vertical (1 µm, best in class), high-speed inspection (33 cm/sec2 at 20 µm resolution; 13.8 cm/sec2 at 10 µm resolution), and easy programming and maintenance in that program generation is accomplished in approximately five minutes and consistent results are provided, regardless of the operator.
Additionally, the system offers many benefits to users, such as an automatic calibration function for easy maintenance, SPC software that is included as standard for detailed analysis and traceability, and reliable and accurate zero plane reference points.
Visit Tim Cappoen, ATE Account Manager, in Booth #459 at the show to discuss the capabilities of the Anritsu 3-D solder paste inspection system. For more information about the Anritsu 3-D In-Line Inspection System, visit http://www.seikausa.com.
Seika Machinery, Inc. (SMI) is a subsidiary of Seika Corporation, Japan and member of the Mitsubishi Global Group. SMI provides electronics manufacturers with advanced machinery, superior materials and engineering services.