Seika’s new Solder Paste Recycling Unit enables approximately 90 percent of waste solder paste to be recovered as solder bar. The system provides a major decrease in disposal costs for factory waste, a reduction in CO2 emissions, and reduced costs for solder bar as a result of recycling waste. As an additional benefit, the recycling unit enables selection of manual mode and automatic mode using a touch screen panel.
The Innovative Technology Center will feature products and services at the show that represent new or emerging technology with real, relevant value to the electronics manufacturing supply chain for printed circuit board design, fabrication, assembly or test.
The display will be located in the Bayside Foyer outside of the exhibit hall.
For more information about Seika’s Solder Paste Recycling Unit, stop by Booth #459 at the show or visit http://www.seikausa.com.
Seika Machinery, Inc. (SMI) is a subsidiary of Seika Corporation, Japan and member of the Mitsubishi Global Group. SMI provides electronics manufacturers with advanced machinery, superior materials and engineering services.