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FCT Assembly Debuts Root Cause Analysis Service

Feb 09, 2011

FCT Assembly and Fine Line Stencil introduce the company’s innovative Root Cause Analysis Service. FCT Assembly developed this service to specifically address the need to quickly determine the root cause(s) of low yields.

"As we try to offer more services to our customers, Root Cause Analysis seems to be one that is truly needed in today's market and we are pleased to be able to offer this service to our customers," said Mike Scimeca, President & CEO.

Most OEMs and CMs are periodically confronted with challenging assemblies that have low yields and must be fixed at rework. Unfortunately, rework costs time and money, and decreases the reliability of the product. These assembly challenges will only increase as component sizes continue to decrease. While OEMs and CMs can determine the root cause(s) of the low yields, most do not have the capacity or time to take on this difficult task.

The new Root Cause Analysis Service quickly determines the root cause(s) of low yields anywhere in the assembly process and then provides a sound solution to the customer for yield improvement. This proven process can significantly improve process yields with any assembly, regardless of complexity.

For more information about FCT Assembly’s Root Cause Analysis Service, visit

FCT Assembly consists of three divisions: FCT Solder, Fine Line Stencil and A-Laser. With numerous facilities in the United States, FCT is one of the electronics industry’s leading manufacturers of lead-free and leaded solder products, superior quality stencils and precision cut parts.

The company sets itself apart from its competitors by continuously studying new products and processes in order to uphold its reputation as a leader in technology. FCT’s customers can always count on the company to use the latest technology and to supply products with the highest quality.

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