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SMTA Announces Best of Conference From 2011 Pan Pacific Symposium

Feb 05, 2011

Minneapolis, MN - The Annual Pan Pacific Microelectronics Symposium & Exhibition that took place January 18-20, 2011, at the Hapuna Beach Prince Hotel, on the Big Island of Hawaii was well received by attendees from North America, Asia, and Europe. Speakers at the Pan Pacific Symposium promoted international technical exchange and joined in a diverse forum for extensive networking among microelectronics professionals from around the world.

SMTA reported that attendance increased 20% from last year. IBM keynote, Armin Knoll, presented “3D Nanofabrication Using Heated Probes - Towards MHZ Patterning Rates.” George Gregoire of Dimensional Imprint Technology, Inc. gave the second keynote presentation titled, "Imprinted PWBs: Will a Smoldering Technology Catch Fire?" A special new session, "Strategic Directions - Mapping the Future around the World," was very well received by attendees.

As rated by the attendees, the Best of Conference Award was presented to Joseph Fjelstad, Verdant Electronics, for his paper titled, "Past, Present and Future of Solderless Assembly." In his paper, Joe examined some of the different solderless assembly methods proposed or used over the years by the electronics industry and took a look forward at some future solutions.

Technical papers from all sessions are currently featured in the 2011 Pan Pacific Symposium Proceedings available in the SMTA Bookstore at http://www.smta.org/store/book_store.cfm.

For more information on the Pan Pacific Microelectronics Symposium & Exhibit, contact SMTA administrator JoAnn Stromberg at 952-920-7682 or joann@smta.org.

The SMTA membership is an international network of professionals who build skills, share practical experience and develop solutions in electronic assembly technologies, including microsystems, emerging technologies, and related business operations.

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