SMT, PCB Electronics Industry News

SMT, PCB Electronics Industry News

News from Ironwood Electronics


Stamped Spring Pin BGA Socket for Burn-in Characterization

Feb 03, 2011

Ironwood Electronics recently introduced a new BGA socket addressing burn-in characterization requirements for BGA devices - CBT-BGA-6011.

Socket your 48 pin BGA using Extreme Temperature Socket with Superior Electrical Performance

The contactor is a stamped spring pin with 19 gram actuation force per ball and cycle life of 500,000 insertions. Low force eliminates ball sticking issues due to temperature testing. The self inductance of the contactor is 0.93 nH, insertion loss < 1 dB at 23.2 GHz and contact resistance is <16mOhms. The current capacity of each contactor is 8 amps at 80C temperature rise. Socket temperature range is -55C to +180C. Socket also features a floating guide for precise ball to pin alignment. The specific configuration of the package to be tested in the CBT-BGA-6011 is a BGA, 9x12mm, 1mm pitch, 48 position, 9x11 ball array. The socket is mounted using supplied hardware on the target PCB with no soldering, and uses smallest footprint for nearby passive components. To use, place the BGA device into the socket base and close the socket lid assembly on to the base using the latch. This socket utilizes spring loaded compression mechanism for precise actuation. This socket can be used for hand test and burn-in characterization as well as production burn-in using automated chip loading and un-loading.

Pricing for the CBT-BGA-6011 is $600 at qty 1 with reduced pricing available depending on quantity required.

You must be a registered user to talk back to us.

More News from Ironwood Electronics

Apr 06, 2011 -

8 GHz Bandwidth Socket for Intel's ICH6 (I/O Controller Hub 6) BGA Package

Mar 22, 2011 -

Stamped Spring Pin BGA Socket for IDT's FCBGA144

Mar 11, 2011 -

Elastomer Socket for Infineon's BGA221

Feb 26, 2011 -

GHz Bandwidth Socket for Dual WLCSP

Feb 14, 2011 -

Prototype and Debug 96 ball BGA with Ease

Feb 03, 2011 -

Stamped Spring Pin BGA Socket for Burn-in Characterization

Jan 12, 2011 -

ATE Spring Pin BGA Socket for Digital Camera Processor

Dec 10, 2010 -

Spring Pin Socket for Kelvin Resistance Measurement

Nov 30, 2010 -

Package Converters Enable Testing Generation I product on Generation II System

Stamped Spring Pin BGA Socket for Burn-in Characterization news release has been viewed 1510 times

PCB Soldering Tools

JTAG Live PCB Debug Software