SMT, PCB Electronics Industry News

Stamped Spring Pin BGA Socket for Burn-in Characterization

Feb 03, 2011

Ironwood Electronics recently introduced a new BGA socket addressing burn-in characterization requirements for BGA devices - CBT-BGA-6011.

Socket your 48 pin BGA using Extreme Temperature Socket with Superior Electrical Performance

The contactor is a stamped spring pin with 19 gram actuation force per ball and cycle life of 500,000 insertions. Low force eliminates ball sticking issues due to temperature testing. The self inductance of the contactor is 0.93 nH, insertion loss < 1 dB at 23.2 GHz and contact resistance is <16mOhms. The current capacity of each contactor is 8 amps at 80C temperature rise. Socket temperature range is -55C to +180C. Socket also features a floating guide for precise ball to pin alignment. The specific configuration of the package to be tested in the CBT-BGA-6011 is a BGA, 9x12mm, 1mm pitch, 48 position, 9x11 ball array. The socket is mounted using supplied hardware on the target PCB with no soldering, and uses smallest footprint for nearby passive components. To use, place the BGA device into the socket base and close the socket lid assembly on to the base using the latch. This socket utilizes spring loaded compression mechanism for precise actuation. This socket can be used for hand test and burn-in characterization as well as production burn-in using automated chip loading and un-loading.

Pricing for the CBT-BGA-6011 is $600 at qty 1 with reduced pricing available depending on quantity required.

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