IPC and Northrop Grumman Sponsor HDI Conference

Jan 20, 2011

IPC - Association Connecting Electronics Industries® will host the IPC Conference on HDI: Strategies for the 21st Century on March 1–2, 2011, at the National Electronics Museum in Baltimore, Md. Sponsored by Northrop Grumman Corporation, the two-day event includes technical workshops on March 1 and a full-day technical conference on March 2.

Following an evening networking reception on March 1, the technical conference will kick off on March 2 with a look at a High Performance Technology Roadmap presented by Northrop Grumman Corporation. The conference will also provide perspective from the military and medical sectors, and cover assembly-related issues and HDI board reliability concerns as well as considerations to make in design, materials and processes. In addition, practical lessons learned on HDI implementation will be shared.

Conference speakers include noted industry experts from companies such as Intel Corporation; Dow Electronic Materials; DuPont; L-3 Avionics Systems Inc.; Medtronic Microelectronics Center; Arlon MED; Chemcut Corp.; Eltek Ltd.; Eagle Test Systems; Mentor Graphics Corp.; OMG Electronic Chemicals, LLC; and Via Systems.

On the day preceding the conference, two half-day workshops include: Creating a PCB Design with HDI Technology, by Dan Smith, CID+, PCB Specialist 4, Northrop Grumman; and Advanced Microvia Structures for Next-Generation HDI Circuits, by Thomas Buck, Senior Technologist, DDi.

For more information and to register for the IPC Conference on HDI: Strategies for the 21st Century, visit http://www.ipc.org/HDI-conference.

IPC (www.IPC.org) is a global trade association based in Bannockburn, Ill., dedicated to the competitive excellence and financial success of its 2,700 member companies which represent all facets of the electronics industry, including design, printed board manufacturing, electronics assembly and test. As a member-driven organization and leading source for industry standards, training, market research and public policy advocacy, IPC supports programs to meet the needs of an estimated $1.85 trillion global electronics industry. IPC maintains additional offices in Taos, N.M.; Arlington, Va.; Garden Grove, Calif.; Stockholm, Sweden; Moscow, Russia; Bangalore, India; and Shanghai, Shenzhen and Beijing, China.

You must be a registered user to talk back to us.

More News from Association Connecting Electronics Industries (IPC)

Apr 22, 2017 -

Congresswoman Discusses U.S. Policy Priorities with IPC Member-company, TTM Technologies

Apr 13, 2017 -

Congressman Discusses U.S. Policy Priorities with Staff at IPC Member-company, VirTex

Apr 11, 2017 -

SEC Suspends Enforcement of Conflict Minerals Rule, Cites IPC Comments Statement from John Mitchell, IPC President and CEO

Apr 11, 2017 -

IPC Membership in Europe Grows to More than 600 Company Sites Brussels office provides full suite of IPC products and services

Apr 04, 2017 -

IPC Supports EU Council Formal Approval of Voluntary Conflict Minerals Requirements for Manufacturers

Mar 31, 2017 -

IPC Announces Growing Industry Support for the Connected Factory Exchange (CFX) Initiative

Mar 31, 2017 -

North American PCB Order Growth Boosts Book-to-Bill Ratio

Mar 27, 2017 -

IPC Membership Reaches Significant Milestone IPC membership is now more than 4,000 member-sites strong

Mar 23, 2017 -

IPC Announces Honorees of Government IMPACT Award

Mar 14, 2017 -

IPC Global Marketplace Delivers Intelligent Search Technology

(821) more news from Association Connecting Electronics Industries (IPC)

IPC and Northrop Grumman Sponsor HDI Conference news release has been viewed 769 times

Large PCB Dispensing System

PCB, BGA Rework Services