Following an evening networking reception on March 1, the technical conference will kick off on March 2 with a look at a High Performance Technology Roadmap presented by Northrop Grumman Corporation. The conference will also provide perspective from the military and medical sectors, and cover assembly-related issues and HDI board reliability concerns as well as considerations to make in design, materials and processes. In addition, practical lessons learned on HDI implementation will be shared.
Conference speakers include noted industry experts from companies such as Intel Corporation; Dow Electronic Materials; DuPont; L-3 Avionics Systems Inc.; Medtronic Microelectronics Center; Arlon MED; Chemcut Corp.; Eltek Ltd.; Eagle Test Systems; Mentor Graphics Corp.; OMG Electronic Chemicals, LLC; and Via Systems.
On the day preceding the conference, two half-day workshops include: Creating a PCB Design with HDI Technology, by Dan Smith, CID+, PCB Specialist 4, Northrop Grumman; and Advanced Microvia Structures for Next-Generation HDI Circuits, by Thomas Buck, Senior Technologist, DDi.
For more information and to register for the IPC Conference on HDI: Strategies for the 21st Century, visit http://www.ipc.org/HDI-conference.
IPC (www.IPC.org) is a global trade association based in Bannockburn, Ill., dedicated to the competitive excellence and financial success of its 2,700 member companies which represent all facets of the electronics industry, including design, printed board manufacturing, electronics assembly and test. As a member-driven organization and leading source for industry standards, training, market research and public policy advocacy, IPC supports programs to meet the needs of an estimated $1.85 trillion global electronics industry. IPC maintains additional offices in Taos, N.M.; Arlington, Va.; Garden Grove, Calif.; Stockholm, Sweden; Moscow, Russia; Bangalore, India; and Shanghai, Shenzhen and Beijing, China.