SMT, PCB Electronics Industry News
  • SMTnet
  • »
  • Industry News
  • »
  • Seven IPC APEX EXPO™ Technical Conference Sessions Go Global - Live From Las Vegas

Seven IPC APEX EXPO™ Technical Conference Sessions Go Global - Live From Las Vegas

Jan 20, 2011

IPC — Association Connecting Electronics Industries® will introduce a cyber conference at IPC APEX EXPO in Las Vegas in 2011. The IPC APEX EXPO Cyber Conference will feature live broadcasts and post-show archives of seven of the show’s thirty-five technical conference sessions on April 12–14, 2011.

Offering a new approach to learning, the IPC APEX EXPO Cyber Conference will enable individuals who are not able to travel to the show to experience a portion of the world’s premier technical conference for the electronics manufacturing industry from the convenience of their offices, homes or even on the road. In addition, since the IPC APEX EXPO technical conference includes up to five sessions running concurrently, having selected sessions available in the archive will allow on-site attendees to schedule their time more efficiently and attend more meetings and programs.

"As much as we'd love to see everyone in our industry in Las Vegas, we understand that for various reasons, sometimes that’s not possible,” says Kim Sterling, IPC vice president of membership, marketing & communications. “Cyber conference registrants will be able to get some of the benefits of the industry’s premier technical conference by viewing the online live stream of seven select sessions as they take place. They’ll be able to view the speaker, watch and download the presentation slides and interact and ask questions via live text chat."

The seven cyber conference sessions will feature new, never-before-published research:

S02: Encapsulation — Tuesday, April 12, 2011 1:30 pm–3:00 pm PT

A New Method for Measuring Conformal Coating Adhesion, Christopher Hunt, Ph.D., National Physical Laboratory

Introducing Novel Flame Retardant Materials to Produce Exceptionally Low Viscosity, High Temperature Resistant Epoxy Encapsulation Compounds, XiaoPing Lei, H. K. Wentworth Ltd.

Exploring the Performance of Silicone Gels at Low and High Temperatures, Carlos Montemayor, Dow Corning Corporation

S08: Soldering Processes II — Tuesday, April 12, 2011 3:15 pm–4:45 pm PT

Laser Based Technology for Solder Ball: Repair, Rework, and Reballing, Andrew Strandjord, Ph.D., Pac Tech USA Packaging Technologies Inc.

A Cost Effective and User Friendly N2 Inerting Technology for Lead-Free Wave Soldering, Chun Christine Dong, Ph.D., Air Products & Chemicals

Case Study Comparing the Solderability of a Specific Pb-Free, No-Clean Paste in Vapor Phase and Convection Reflow, Theron Lewis, IBM Corporation

S13: Lead Free: Surface Effects — Wednesday, April 13, 2011 9:00 am–10:00 am PT

Effects of Tin Whisker Formation on Nanocrystalline Copper, David Lee, Ph.D., Johns Hopkins University

Effect of Gold Content on the Reliability of SnAgCu Solder Joints, Jianbiao Pan, Cal Poly State University

S16: PCB Reliability Test Methods — Wednesday, April 13, 2011 10:15 am–11:45 am PT

A New Approach for Early Detection of PCB Pad Cratering Failures, Anurag Bansal, Cisco Systems Inc.

Analysis of Electrochemical Migration Kinetics Using Electrochemical Impedance Spectroscopy, Xiaofei He, University of Maryland

The Effects of Reflow on Conductive Anodic Filament (CAF) Performance of Materials, Kim Morton, Viasystems Technology Corp. LLC

S24: Cleaning — Wednesday, April 13, 2011 1:30 pm–3:30 pm PT

New Cleaning Agent Designs for Removing No-Clean Lead-Free Flux Residues, Mike Bixenman, DBA, Kyzen Corporation

Meeting the Challenge of Removing Flux Residues from Electronic Circuitry Utilizing Low Standoff Heights, Michael Savidakis, Petroferm

Comparative Cleaning Study to Showcase the Effective Removal of OA Flux Residues, Umut Tosun, ZESTRON America

Defluxing for New Assembly Requirements, Barbara Kanegsberg, BFK Solutions

S28: Thermal Cycling Lead-Free Reliability — Thursday, April 14, 2011 9:00 am–10:00 am PT

Pb-Free Solder Joint Reliability in a Mildly Accelerated Test Condition, Richard Coyle, Alcatel-Lucent

The Effects of Non-Filled Microvia in Pad on Pb-Free Solder Joint Reliability of BGA and QFN Packages in Accelerated Thermal Cycling, Joseph Smetana, Alcatel-Lucent

S33: Embedded — Thursday, April 14, 2011 10:15 am–11:45 am PT

Development of a Design & Manufacturing Environment for Reliable and Cost-Effective PCB Embedding Technology, Arnaud Grivon, Thales Services EPM

Failure Mechanisms in Embedded Planar Capacitors during High Temperature Operating Life (HTOL) Testing, Mohammed Alam, University of Maryland

Components: A Comparative Analysis of Reliability, Christopher Ryder, AT&S Austria Technologie & Systemtechnik AG

Registrants of the cyber conference as well as registrants of the full IPC APEX EXPO technical conference will have free access to archives of the seven sessions until August 31. In addition, they will each receive the full technical conference proceedings.

For more information and to register for the IPC APEX EXPO Cyber Conference, visit http://www.IPCAPEXEXPO.org/Cyber-Conference.

IPC (www.IPC.org) is a global trade association based in Bannockburn, Ill., dedicated to the competitive excellence and financial success of its 2,700 member companies which represent all facets of the electronics industry, including design, printed board manufacturing, electronics assembly and test. As a member-driven organization and leading source for industry standards, training, market research and public policy advocacy, IPC supports programs to meet the needs of an estimated $1.85 trillion global electronics industry. IPC maintains additional offices in Taos, N.M.; Arlington, Va.; Garden Grove, Calif.; Stockholm, Sweden; Moscow, Russia; Bangalore, India; and Shanghai, Shenzhen and Beijing, China.

Aug 10, 2017 -

Congressman John R. Carter Discusses Pro-Manufacturing Policies with IPC-member Company, VirTex

Aug 06, 2017 -

IPC Committee Selects Communication Transport Protocol for Connected Factory Initiative

Aug 01, 2017 -

North American PCB Order Growth Fuels Rise in Book-to-Bill Ratio

Jul 23, 2017 -

Senator Ron Johnson Discusses U.S. Policy Priorities in Townhall Discussion with IPC-member Company, VirTex MTI

Jul 17, 2017 -

IPC Extends Deadline on Call for Participation for IPC APEX EXPO 2018 Deadline for technical conference paper abstracts extended to: July 21, 2017

Jul 16, 2017 -

IPC Invites Industry Members to Participate on IPC European Standards Steering Committee

Jul 05, 2017 -

North American PCB Business Weakens but Book-to-Bill Ratio Remains Positive

Jun 29, 2017 -

IPC Invites Industry Leaders to Participate in New Global Data Service Pulse of the Electronics Industry to provide insight on health of industry

Jun 20, 2017 -

Zentech Manufacturing, Inc. First to Recertify for IPC Qualified Manufacturers Listing

Jun 14, 2017 -

IPC Submits Comments to Trump Administration Regarding Modernization of NAFTA

840 more news from Association Connecting Electronics Industries (IPC) »

Aug 23, 2017 -

Count On Tools Inc. Expands Panasonic Nozzles for AM100 Placement Equipment

Aug 23, 2017 -

Saelig Introduces Industrial Raspberry Pi Controller ComfilePi

Aug 23, 2017 -

Vi TECHNOLOGY Combines 3D Inspection with SIGMA Link for Smart Factories

Aug 23, 2017 -

Hanwha Techwin and ESE Partner to Bring Customers Value and Versatility

Aug 23, 2017 -

Laser Design CyberGage®360, Automated 3D Scanning & Inspection System Adopted by Proto Labs in Their State-of-the-Art Metrology Lab

Aug 23, 2017 -

ZESTRON to Feature HYDRON® Technology at SMTAI

Aug 23, 2017 -

The Hermes Standard: Viscom working on first field tests

Aug 19, 2017 -

See Latest Dispense Technology Demonstrations From GPD Global at NEPCON 2017

Aug 17, 2017 -

ZESTRON Americas Announces New Regional Sales Manager

Aug 17, 2017 -

SEHO Soldering Expert to Discuss Resource & Cost Efficient Wave Soldering at SMTAI

See electronics manufacturing industry news »

Seven IPC APEX EXPO™ Technical Conference Sessions Go Global - Live From Las Vegas news release has been viewed 885 times

  • SMTnet
  • »
  • Industry News
  • »
  • Seven IPC APEX EXPO™ Technical Conference Sessions Go Global - Live From Las Vegas
SMT machines spare parts

SMTA International 2017