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International Wafer-Level Packaging Conference and Exhibition

Jan 18, 2011

International Wafer-Level Packaging Conference and Exhibition

www.iwlpc.com

October 5-6, 2011

Marriott Hotel

Santa Clara, CA

Show Hours: 10/5 – 10:00am – 6:00pm

10/6 – 9:00am – 1:00pm

Exhibitor Reception: 10/5 – 5:00pm – 6:00pm

Contact: Patti Hvidhyld (952)920-7682 or patti@smta.org

Sponsored jointly by the SMTA and Chip Scale Review magazine, the annual IWLPC explores cutting edge topics in wafer-level packaging and IC/MEMS/MOEMS packaging, including 3D/Stacked/CSP/SiP/SoP and mixed technology packages.

2010 IWLPC attendance reached an all-time high! Attendees came from over 13 countries around the world.

Conference Contact: Patti Hvidhyld (952)920-7682 or patti@smta.org

Exhibits Contact: Seana Wall (952)920-7682 or seana@smta.org

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