It has been more than 10 years since lead-free solders were introduced to the Japanese market. This presentation will report the latest trends in the usage of the Sn-Cu-Ni+Ge lead-free alloy that initially established its reputation in wave soldering. Mr. Nishimura also will discuss developments in halogen-free fluxes.
Tetsuro Nishimura is a graduate in Metallurgical Engineering from Kansai University, Osaka, Japan and joined Nihon Superior Co., Ltd in March 1980 to work in sales, product development and technical support. His work lead to the development and patenting of a low melting point solder, a thermal fatigue resistant solder and, with Takada Pharmaceutical Industries, a no-clean flux.
When the electronics industry started to change to lead-free technologies, Tetsuro developed a tin-copper-nickel-germanium alloy solder that, under the brand name SN100C®, earned the company recognition around the world. Tetsuro’s achievements with Nihon Superior have been recognized with an Intellectual Property Achievement Award from the Japanese Patent Office of the Ministry of Economy Trade and Industry and a Best Company Award in the Osaka Monadzukuri program.
Nihon Superior was founded in 1966 when it began marketing unique flux products imported from the US. The company made its mark on society by gathering the most advanced soldering and brazing technologies and products from around the world, and supplying them to companies in the metal-joining industry. A turning point for the company came when it started developing its own soldering materials and with the success of its unique SN100C lead-free solder alloy Nihon Superior has become a major player in the global market. To support the growing demand for its products Nihon Superior has established manufacturing and sales centers in Japan, China and other Asian countries and formed business partnerships with companies in other markets.